Khuluma Ngamandla #Ibhuku Le-LED Lokupakisha: Ulwazi Lobuchwepheshe Bokupakisha Be-LED

Inqubo yokupakishwa kwezibani ze-LED iwukuqukethwe kobuchwepheshe obuphezulu. Kulo mbuthano, kuningi okuthiwa izimfihlo zezentengiselwano. Ngenxa yokuthi lezi zinto zihlobene nokuphila nokufa kwenkampani, ezinye izinto azenziwa obala, okuhlanganisa izinqubo ezithile noma izinqubo ezithile noma izinqubo ezithile noma izinqubo ezithile noma I-Craft. Lezi zinto zinquma ngokuqondile ukuthi inkampani ingaba nokuncintisana okumaphakathi. Namuhla, ngizokhulula ulwazi lobuchwepheshe bokupakisha bemboni ye-LED lapha. Ngiyethemba ukukusiza. 1. Inqubo yokukhiqiza 1. Ukukhiqiza: A) Ukuhlanza: Ukusebenzisa i-ultrasonic yokuhlanza i-PCB noma amabakaki e-LED, nokomisa. b) Ukulayisha: Ngemva kokuba ama-electrode we-LED core (umbuthano omkhulu) enwetshiwe, ithubhu elinwetshiwe (ishidi elikhulu eliyindilinga) libekwe etafuleni lekristalu lomgogodla, futhi i-tube core isetshenziswa ngaphansi kwe-microscope ngaphansi kwe-microscope. Ngamunye ufakwa kumaphedi ahambisanayo e-PCB noma amabakaki e-LED, bese kwenziwa i-sintering ukuze kwelaphe ingcina yesiliva. C) Ukushisela okucindezelayo: Sebenzisa i-aluminium noma umshini wokushisela wezintambo zegolide ukuxhuma i-electrode kumongo weshubhu le-LED ekuholeni kumjovo wamanje. I-LED ifakwe ngokuqondile ku-PCB, futhi umshini wokushisela we-aluminium uvame ukusetshenziswa. (Yenza ukukhanya okumhlophe I-Top-LED idinga umshini wokushisela izintambo zegolide) D) Ukupakisha: Nge-glue iphuzu, vikela umgogodla weshubhu le-LED kanye nocingo olushiselwe nge-epoxy. I-point glue ebhodini le-PCB inezidingo eziqinile ekubunjweni kwe-colloidal shape ngemva kokuphulukiswa, okuhlobene ngokuqondile nokukhanya komkhiqizo oqediwe we-backlight. Le nqubo izophinde yenze umsebenzi we-fluorescence powder (i-LED ekhanyayo emhlophe). E) Ukushisela: Uma ukukhanya kwangemuva kuyi-SMD-LED noma amanye ama-LED ahlanganisiwe, ngaphambi kwenqubo yomhlangano, i-LED idinga ukushiselwa ebhodini le-PCB. F) Ukusika ulwelwesi: Sebenzisa isikhunta sokubhoboza ukuze usike ama-diffuser ahlukahlukene, ulwelwesi olukhanyayo, njll. Womthombo wokukhanya wangemuva. G) ukuhlanganisa: Faka mathupha isikhundla esilungile sezinto ezihlukahlukene zomthombo we-backlight ngokuya ngezidingo zomdwebo. H) Ukuhlola: Hlola ukuthi ingabe amapharamitha we-optoelectronics womthombo we-backlight kanye nokufana kokukhanya kuphumile ekukhanyeni. 2. Ukupakisha: Ukupakisha umkhiqizo oqediwe njengoba kudingeka bese ungena endaweni yokugcina impahla. Okwesibili, inqubo yokupakisha 1 Umsebenzi wokupakishwa kwe-LED ukuxhuma umthofu wangaphandle ku-electrode ye-chip ye-LED, ngesikhathi esifanayo uvikele i-chip ye-LED, futhi ubambe iqhaza ekuthuthukiseni ukusebenza kahle kokukhipha ukukhanya. Izinqubo eziyinhloko zihlanganisa, i-pressure welding, ukupakisha. 2. Ifomu lokupakisha le-LED Ifomu lokupakisha le-LED lingashiwo ukuthi lihlukahlukene. Ikakhulukazi isebenzisa usayizi womumo ohambisanayo, izindlela zokuphikisa zokulahla ukushisa kanye nemiphumela yokukhanya ngokuya ngezinhlelo zokusebenza ezihlukene. Ama-LED ahlukaniswa ngendlela yokupakisha afaka i-LAMP-LED, TOP-LED, SIDE-LED, SMD-LED, High-Power-LD, njll. 3. Inqubo yokupakisha ye-LED A) Ukuhlolwa kwesibuko sokuhlola i-chip: 1. Ukuthi indawo ebonakalayo inomonakalo wemishini kanye ne-lockhill; 2. Ukuthi usayizi we-chip nosayizi we-electrode uyahlangabezana yini nezidingo zenqubo; 3. Ukuthi iphethini ye-electrode iphelele yini. B) Ngenxa yokuthi i-chip ye-LED isesikhaleni esincane (cishe u-0.1mm) ngemva kokuklwejwa kwe-chip ye-LED, ayihambisani nokusebenza kwenqubo yokuthunyelwe. Sandisa ifilimu ye-chip yokunamathisela usebenzisa umshini wokwandisa. Kuyisikhala se-chip ye-LED esifinyelela ku-0.6mm. Inganwetshwa futhi ngesandla, kodwa kulula ukubangela izinkinga ezimbi njengokulahla imfucuza ye-chip. C) Iglue esiliva noma i-insulating glue endaweni ehambisanayo ye-glue yephoyinti endaweni ehambisanayo yebakaki le-LED. (Okwe-GAAS kanye ne-SIC conductive substrates, ukukhanya okubomvu, ukukhanya okuphuzi, i-chip ephuzi -green ene-electrode yangemuva ngemuva, sebenzisa inhlaka esiliva. Ukuze uthole ukukhanya okuluhlaza okwesibhakabhaka kanye ne-chip ye-LED eluhlaza yesisekelo sesafire insulating, sebenzisa insulating glue ukulungisa chip. ) Ubunzima benqubo bulele ekulawuleni inani lokunamathela, futhi kunezidingo zenqubo enemininingwane ekuphakameni kokuphakama kwe-colloid kanye nephuzu lephuzu lephuzu lephuzu lephuzu lephuzu lephuzu. . Ngenxa yokuthi iglue esiliva kanye ne-insulating glue inezidingo eziqinile ekugcinweni nasekusetshenzisweni, isikhathi sokuvuka, ukunyakazisa, kanye nokusetshenziswa kweglue esiliva yizo zonke izinto okufanele zinakwe. D) Ngokungafani nokulungiswa nokugcwalisa iphuzu, iglue elungiswayo iwukusebenzisa iglue esiliva ku-electrode yangemuva ye-LED ngomshini wokulungisa, bese ufaka i-LED eneglue esiliva ngemuva kubakaki be-LED. Ukusebenza kahle kokulungiselela kuphakeme kakhulu kune-point glue, kodwa akuyona yonke imikhiqizo esebenzayo ekulungiseleleni inqubo. E) Ama-spines enziwe ngezandla Setha ukunwetshwa kwe-chip ye-LED (ukulungiselela noma ijeli engakhokhelwa) endaweni yetafula lameva. Ubakaki we-LED ubekwe ngaphansi kwe-fixture. Ngaphansi kwe-microscope, i-chip ye-LED ibhobozwa endaweni ehambisanayo ngenaliti ngaphansi kwesibonakhulu. Uma kuqhathaniswa nokulayisha okuzenzakalelayo kwe-hand-cranked, inenzuzo eyodwa uma iqhathaniswa nayo, elungele ukushintsha ama-chips ahlukene nganoma yisiphi isikhathi. Ilungele imikhiqizo edinga ukufaka ama-chips ahlukahlukene. f) Ukulayisha okuzenzakalelayo kanye nokuhlanganiswa okuzenzakalelayo empeleni kuhlanganiswe nezinyathelo ezimbili: i-silver gum (insulating gum) kubakaki be-LED kubakaki be-LED. Indawo, bese uyibeka endaweni yobakaki ehambisanayo. Ukufakwa okuzenzakalelayo kujwayelene kakhulu nohlelo lokusebenza kwemishini ngokobuchwepheshe, futhi ngesikhathi esifanayo lungisa ukunemba nokunemba kokufakwa kwemishini. Zama ukusebenzisa umlomo wokumunca izinkuni zeglue ekukhetheni ukumunca ukuvimbela ukulimala ebusweni be-chip ye-LED, ikakhulukazi i-orchid ne-chip eluhlaza kufanele isetshenziswe. Ngoba umlomo wensimbi uzoklwebha isendlalelo samanje sokusabalala kwendawo ye-chip. G) Inhloso ye-sintering kanye ne-sintering ukuphulukisa iglue esiliva, i-sintering idinga izinga lokushisa lokuqapha ukuvimbela ukwehluleka kwenqwaba. Izinga lokushisa le-sintering ye-sintering ye-gum yesiliva ngokuvamile lilawulwa ku-150 C, futhi isikhathi sokucwilisa amahora angu-2. Ngokwesimo sangempela, ungakwazi ukujwayela ku-170 C, ihora elingu-1. Insulation glue ngokuvamile 150 C, 1 ihora. I-ovini ye-rubber yesiliva ye-sintering kufanele ivule umkhiqizo oshintshwa ngokufaka i-sintering ngokuvumelana nezidingo zenqubo (noma ihora elingu-1), futhi akufanele uyivule ngokuthanda kwakho. Ihhavini elishisayo akumele lisasebenzisa ezinye izinjongo ukuvimbela ukungcola. H) Inhloso ye-welding yokucindezela nokushisela izoholela i-electrode ku-chip ye-LED ukuze iqedele umsebenzi wokuxhuma ngaphakathi nangaphandle komkhiqizo. Kunezinhlobo ezimbili zenqubo yokushisela ingcindezi ye-LED: i-golden ball welding kanye ne-aluminium wire pressure welding. Isithombe esingakwesokudla yinqubo yokushisela i-aluminium wire pressure. Okokuqala cindezela iphuzu lokuqala ku-electrode ye-LED chip, bese udonsa intambo ye-aluminium uyiyise kubakaki abahambisanayo, bese ucindezela iphoyinti lesibili ukuze uphule intambo ye-aluminium. Inqubo yokushisela ibhola likasilika yegolide ishisa ibhola ngaphambi kokucindezela iphuzu lokuqala, futhi yonke le nqubo iyafana. I-Pressive welding iyisixhumanisi esiyinhloko kubuchwepheshe bokufaka be-LED. Inqubo eyinhloko yenqubo idinga ukuqapha ukuma kwentambo yegolide yokushisela (i-aluminium) i-arched silk shape, ukuma kwejoyinti elihlanganisiwe. Ucwaningo olunzulu ngenqubo yokushisela ingcindezi lubandakanya izinkinga eziningi, njengegolide (i-aluminium) izinto zikasilika, amandla e-ultrasonic, ingcindezi yokushisela, ummese wokusika (umlomo wensimbi), ummese wokuhlukanisa (umlomo wensimbi) umzila wokunyakaza, njll. (Isibalo esingezansi yizithombe ezincane zamajoyinti okushisela acindezelwe imimese emibili ehlukene ngaphansi kwezimo ezifanayo. Okubili kunomehluko esakhiweni esincane, esithinta ikhwalithi yomkhiqizo. ) Asisekhathele lapha. I) Ukupakishwa kwe-dot -glue packaging LED ikakhulukazi izinhlobo ezintathu: ingcina encane, ukuvala uphawu, kanye nokucindezela kwesikhunta. Ngokuyisisekelo, ubunzima bokulawulwa kobuciko amabhamuza, izinto eziningi zokwakha, namabala amnyama. Idizayini ikhethwa ngokuyinhloko yizinto ezibonakalayo, futhi i-epoxy ehlanganisiwe nobakaki kukhethwa. (I-LED evamile ayikwazi ukuphumelela ukuhlolwa kwegesi.) Njengoba kuboniswe emfanekisweni ongakwesokudla, i-Top-LED ne-SIDE-LD isebenza ekufakweni kweglue iphuzu. Izidingo zokupakishwa kwetheyiphu yezandla ziphezulu (ikakhulukazi ukukhanya okumhlophe kwe-LED). Ubunzima obukhulu ukulawulwa kwenani lokugcwaliswa kwamaphuzu, ngoba i-epoxy izoshuba ngesikhathi sokusetshenziswa. Ukugcwaliswa kwephuzu kokukhanya okumhlophe kwe-LED nakho kunenkinga yomehluko wombala obangelwa i-fluorescent powder sedimentation. J) Ukupakishwa kwe-lavage Package ye-LAMP-LED isebenzisa indlela yokunisela. Inqubo yokuvala iwukujova i-epoxy ewuketshezi endaweni yokubunjwa ye-LED, bese ufaka ubakaki we-LED onama-lattice. Ngemva kokungeza ihhavini ukuze kuqiniswe i-epoxy. K) Ukupakishwa kwe-Mooming kubeka ubakaki we-LED abashiselwe esibunjeni, futhi amapheya aphezulu naphansi esikhunta asetshenziswa nesikhunta esisebenza ngehydraulic futhi ampompe isivacu. , I-Epoxy Faka umzila werabha ku-slot ngayinye yokubumba ye-LED futhi uqinise. L) I-CICS kanye nokuphulukiswa kwangemuva kokuphulukisa kubhekisela ekwelapheni kwe-encapsulation ye-epoxy. Ngokuvamile, izimo zokuphulukisa i-epoxy zingu-135 C, ihora elingu-1. Ukupakisha ezihambayo ngokuvamile 150 C, 4 imizuzu. M) I-rearcultation yelashwa ukuze kuvunyelwe i-epoxy ukuthi ilashwe ngokugcwele, futhi ngesikhathi esifanayo, i-LED iyashisa futhi iyaguga. Ukwelapha okunethezeka kubaluleke kakhulu ekuthuthukiseni ukuqina kokunamathela kwe-epoxy nobakaki (PCB). Izimo ezijwayelekile ziyi-120 C, amahora angu-4. N) I-Jacking nezingcezu Njengoba i-LED ixhunyiwe ekukhiqizeni (hhayi eyodwa), i-LAMP yokupakisha i-LED isebenzisa i-gluten ukusika ubakaki we-LED. I-SMD-LED isebhodini le-PCB, okudingeka kube umshini we-chip ukuze uqedele umsebenzi wokuhlukanisa. O) Hlola amapharamitha we-optoelectronics we-LED futhi uhlole usayizi womumo. P) Ukupakisha ukubala umkhiqizo oqediwe. I-Ultra -high ekhanyayo ye-LED idinga ukupakishwa kwe-anti-static