Thetha Ngamandla #Incwadi yokuPakisha yeLED: Ulwazi lweTekhnoloji yokuPakisha i-LED

Inkqubo yokupakishwa kwezibane ze-LED ngumxholo we-high-tech. Kwesi sangqa, kukho izinto ezininzi ezibizwa ngokuba ziimfihlo zorhwebo. Ngenxa yokuba ezi zinto zinxulumene nobomi nokufa kwenkampani, ezinye izinto azenziwanga esidlangalaleni, kubandakanywa iinkqubo ezithile okanye iinkqubo ezithile okanye iinkqubo ezithile okanye iinkqubo ezithile okanye iCraft. Ezi zinto ziqinisekisa ngokuthe ngqo ukuba inkampani ingaba nokhuphiswano oluphakathi. Namhlanje, ndiza kukhulula ulwazi lwetekhnoloji yokupakisha yoshishino lwe-LED apha. Ndinethemba lokukunceda. 1. Inkqubo yemveliso 1. Ukuveliswa: A) Ukucoca: Ukusebenzisa i-PCB yokucoca i-ultrasonic okanye izibiyeli ze-LED, kunye nokomisa. b) Ukulayisha: Emva kokuba i-electrodes ye-tube core ye-LED (isangqa esikhulu) yandisiwe, ityhubhu ehlanjululweyo (iphepha elikhulu elijikelezileyo) libekwe kwitafile ye-crystal crystal, kwaye i-tube core isetyenziswe phantsi kwe-microscope phantsi kwe-microscope. Enye nganye ifakwe kwiipads ezihambelanayo zePCB okanye izibiyeli ze-LED, kwaye emva koko i-sintering yenziwa ukunyanga iglue yesilivere. C) I-Welding ecinezelayo: Sebenzisa i-aluminium okanye umatshini wegolide we-wire welding ukudibanisa i-electrode kwi-tube core ye-LED ukuya kwi-injection yangoku. I-LED ifakwe ngokuthe ngqo kwi-PCB, kwaye umatshini we-aluminium welding usetyenziswa ngokubanzi. (Yenza ukukhanya okumhlophe I-Top-LED idinga umatshini wegolide we-wire welding) D) Ukupakishwa: Ngeglue iphuzu, khusela i-core tube ye-LED kunye nocingo oludibeneyo kunye ne-epoxy. Point iglu kwibhodi PCB ineemfuno ezingqongqo kwimilo colloidal imilo emva ukunyanga, nto leyo enxulumene ngqo nokukhanya backlight imveliso egqityiweyo. Le nkqubo iya kwenza kwakhona umsebenzi we-fluorescence powder (isibane esimhlophe se-LED). E) I-Welding: Ukuba i-backlight yi-SMD-LED okanye ezinye ii-LED ezifakiwe, ngaphambi kwenkqubo yendibano, i-LED kufuneka idityaniswe kwibhodi ye-PCB. F) Ukusika inwebu: Sebenzisa i-punching mold ukusika ii-diffusers ezahlukeneyo, ii-membrane ezikhanyayo, njl. Yomthombo wokukhanya ngasemva. G) indibano: Faka ngesandla indawo echanekileyo yezinto ezahlukeneyo zomthombo we-backlight ngokweemfuno zomzobo. H) Uvavanyo: Jonga ukuba i-backlight source optoelectronics parameters kunye nokufana kokukhanya ngaphandle kokukhanya. 2. Ukupakisha: Ukupakisha imveliso egqityiweyo njengoko kufuneka kwaye ungene kwindawo yokugcina impahla. Okwesibini, inkqubo yokupakisha 1.. Umsebenzi wokupakishwa kwe-LED kukudibanisa ukukhokela kwangaphandle kwi-electrode ye-chip ye-LED, ngexesha elifanayo ukhusele i-chip ye-LED, kwaye udlale indima ekuphuculeni ukusebenza kakuhle kokukhutshwa kokukhanya. Iinkqubo eziphambili ziyindibano, i-welding yoxinzelelo, ukupakishwa. 2. Ifom yokupakisha ye-LED ifom yokupakisha ye-LED inokuthi ihluke. Isebenzisa ubukhulu becala ubungakanani bemilo ehambelanayo, imilinganiselo yokunciphisa ubushushu kunye neziphumo zokukhanya ngokwezicelo ezahlukeneyo. Ii-LED zihlelwa ngendlela yokupakisha ziquka i-LAMP-LED, i-TOP-LED, i-SIDE-LED, i-SMD-LED, i-High-Power-LD, njl. 3. Inkqubo yokupakishwa kwe-LED A) Ukuhlolwa kwesipili sokuhlolwa kwe-chip: 1. Nokuba umphezulu wezinto eziphathekayo unomonakalo womatshini kunye ne-lockhill; 2. Ingaba ubungakanani betshiphu kunye nobukhulu be-electrode buhlangabezana neemfuno zenkqubo; 3. Ingaba ipateni ye-electrode igqityiwe. B) Ngenxa yokuba i-chip ye-LED isekho kwisithuba esincinci (malunga ne-0.1mm) emva kokuba i-chip ye-LED ikrwelwe, ayihambisani nokusebenza kwenkqubo yeposi. Sandisa ifilimu ye-adhesive chip usebenzisa umatshini wokwandisa. Sisithuba setshiphu ye-LED eyolulela malunga ne-0.6mm. Isenokwandiswa ngesandla, kodwa kulula ukubangela iingxaki ezimbi ezifana ne-chip yokulahla inkunkuma. C) Iglu yesilivere okanye i-insulating glue kwindawo ehambelanayo yeglue iphuzu kwindawo ehambelanayo ye-bracket ye-LED. (Kwi-GAAS kunye ne-SIC conductive substrates, ukukhanya okubomvu, ukukhanya okutyheli, i-chip etyheli-eluhlaza kunye ne-electrode yangasemva, sebenzisa i-gum yesilivere. Ukukhanya okuluhlaza okwesibhakabhaka kunye ne-green LED chip yesafire insulating base, sebenzisa i-insulating glue ukulungisa i-chip. ) Ubunzima benkqubo buxhomekeke kulawulo lwesixa sokubambelela, kwaye kukho iimfuno zenkqubo ecacileyo ekuphakameni kokuphakama kwe-colloid kunye nenqaku lenqaku lenqaku lenqaku lenqaku lenqaku. . Ngenxa yokuba iglue yesilivere kunye ne-insulating glue ineemfuno ezingqongqo zokugcina kunye nokusetyenziswa, ukuvuka, ukuvuselela, kunye nokusetyenziswa kwexesha leglue yesilivere yiyo yonke imicimbi ekufuneka ihoywe. D) Ngokuchasene nokulungiswa kunye nokuzaliswa kwamanqaku, iglue ilungiselela ukusebenzisa iglue yesilivere kwi-electrode yangasemva ye-LED kunye nomatshini wokulungiselela, uze ufake i-LED ngeglue yesilivere ngasemva kwi-bracket ye-LED. Ukusebenza kakuhle kokulungiswa kuphezulu kakhulu kune-point glue, kodwa akuzona zonke iimveliso ezisebenzayo kwinkqubo yokulungiselela. E) I-spines ezenziwe ngesandla Setha ukwandiswa kwe-chip ye-LED (ukulungiselela okanye i-gel engahlawulwanga) kwi-fixture yetafile yameva. I-bracket ye-LED ifakwe phantsi kokulungiswa. Ngaphantsi kwe-microscope, i-chip ye-LED ihlatywe kwindawo ehambelanayo kunye nenaliti phantsi kwe-microscope. Xa kuthelekiswa nokulayishwa ngokuzenzekelayo kwesandla -i-cranked, inenzuzo enye xa kuthelekiswa nayo, ekulungele ukutshintsha iitshiphusi ezahlukeneyo nangaliphi na ixesha. Kufanelekile kwiimveliso ezifuna ukufaka iindidi zeechips. f) Ukulayishwa okuzenzekelayo kunye nokudibanisa okuzenzekelayo ngokwenene kudityaniswe namanyathelo amabini: i-gum yesilivere (i-insulating gum) kwisibiyeli se-LED kwisibiyeli se-LED. Indawo, emva koko uyibeke kwindawo yesibiyeli esihambelanayo. Ufakelo oluzenzekelayo luqhelene kakhulu nenkqubo yokusebenza kwezixhobo ngokwemigaqo yethekhnoloji, kwaye kwangaxeshanye ulungelelanisa ukuchaneka kwebala kunye nokufakwa kwezixhobo. Zama ukusebenzisa iglu umthi ukufunxa umlomo ekukhetheni ukufunxa ukuthintela umonakalo kumphezulu chip LED, ingakumbi orchid kunye chip eluhlaza kufuneka isetyenziswe. Ngenxa yokuba umlomo wentsimbi uya kukrwela i-spread layer yangoku ye-chip surface. G) Injongo ye-sintering kunye ne-sintering kukuphilisa iglue yesilivere, i-sintering ifuna ukubeka iliso kwiqondo lokushisa ukukhusela ukusilela kwebhetshi. Ubushushu be-sintering ye-sintering ye-gum yesilivere ngokuqhelekileyo ilawulwa kwi-150 C, kwaye ixesha lokutshisa yi-2 iiyure. Ngokwemeko yangempela, unokulungelelanisa kwi-170 C, iyure eli-1. Insulation glue ngokubanzi 150 C, 1 iyure. I-oven ye-rubber yesilivere ye-sintering kufuneka ivule imveliso etshintshwa yi-sintering ngokweemfuno zenkqubo (okanye i-1 iyure), kwaye akufanele uyivule ngokuthanda kwayo. I-oveni yokutshisa kufuneka ingaphindi isebenzise ezinye iinjongo ukuthintela ungcoliseko. H) Injongo yoxinzelelo lwe-welding kunye ne-welding iya kukhokelela i-electrode kwi-chip ye-LED ukugqiba umsebenzi wokudibanisa ngaphakathi nangaphandle kwemveliso. Kukho iintlobo ezimbini zenkqubo ye-LED yoxinzelelo lwe-welding: i-welding yebhola yegolide kunye ne-aluminium yoxinzelelo lwe-wire. Umfanekiso osekunene yinkqubo ye-aluminium yoxinzelelo lwe-wire welding. Okokuqala cofa inqaku lokuqala kwi-electrode yetshiphu ye-LED, emva koko tsala ucingo lwe-aluminiyam kwisibiyeli esihambelanayo, uze ucinezele inqaku lesibini ukuze kwaphule ucingo lwe-aluminiyam. Inkqubo yegolide ye-silk ye-welding yokutshisa ibhola ngaphambi kokucinezela inqaku lokuqala, kwaye yonke inkqubo iyafana. Uxinzelelo lwe-welding likhonkco eliphambili kwitekhnoloji yokupakisha ye-LED. Eyona nkqubo yenkqubo kufuneka esweni imilo welding igolide ucingo (aluminiyam) arched silk imilo, imilo edityanisiweyo welding. Uphando olunzulu malunga nenkqubo ye-welding yoxinzelelo lubandakanya iingxaki ezininzi, ezifana negolide (i-aluminium) izinto zesilika, amandla e-ultrasonic, uxinzelelo lwe-welding pressure, i-knife yokusika (umlomo wentsimbi), i-split -knife (umlomo wentsimbi) i-trajectory yokuhamba, njl. (Umfanekiso ongezantsi yi-micro-photos ye-welding joints ecinezelwe ngamacandelo amabini ahlukeneyo-imela phantsi kweemeko ezifanayo. Aba babini banomahluko kwisakhiwo esincinci, esichaphazela umgangatho wemveliso. ) Asisenadini apha. I) Ukupakishwa kwe-dot -glue yokupakisha i-LED ubukhulu becala ziindidi ezintathu: iglu encinci, ukutywina, kunye noxinzelelo lokungunda. Ngokusisiseko, ubunzima bolawulo lobugcisa ngamaqamza, izixhobo ezininzi, kunye namabala amnyama. Uyilo lukhethwa ngokukodwa ngezinto eziphathekayo, kwaye i-epoxy edibeneyo kunye ne-bracket ikhethiwe. (I-LED Jikelele ayikwazi ukudlula uvavanyo oluqinileyo lwegesi.) Njengoko kuboniswe kumfanekiso oboniswe ngakwesokudla, i-Top-LED kunye ne-SIDE-LD isebenza kwi-point glue packaging. Iimfuno zokupakishwa kwetape yezandla ziphezulu (ingakumbi ukukhanya okumhlophe kwe-LED). Ubunzima obuphambili kulawulo lwesixa sokuzaliswa kwamanqaku, kuba i-epoxy iya kuqina ngexesha lokusetyenziswa. Indawo yokuzaliswa kokukhanya okumhlophe kwe-LED nayo inengxaki yomahluko wombala obangelwa yi-fluorescent powder sedimentation. J) Ukupakishwa kokupakishwa kwelavage LAMP-LED yamkela uhlobo lokunkcenkceshela. Inkqubo yokutywinwa kukufaka i-epoxy engamanzi kwindawo yokubumba i-LED, kwaye emva koko ufake i-lattice-welded bracket ye-LED. Emva kokongeza i-oven ukuqinisa i-epoxy. I-K) Ukupakishwa kwe-Mooming kubeka i-bracket ye-LED edibeneyo kwi-mold, kwaye izibini eziphezulu kunye nezantsi ze-molds zisetyenziselwa ukubunjwa kwe-hydraulic kunye nokupompa i-vacuum. , I-Epoxy Ngena umzila werabha kwindawo nganye yokubumba i-LED kwaye uqinise. L) I-CICS kunye ne-post-curing and curing ibhekisela ekunyangeni kwe-encapsulation ye-epoxy. Ngokubanzi, iimeko zokunyanga i-epoxy yi-135 C, iyure enye. Ukupakishwa kokuhamba ngokuqhelekileyo yi-150 C, imizuzu emi-4. M) I-rearcultation iphiliswa ukwenzela ukuvumela i-epoxy ukuba iphiliswe ngokupheleleyo, kwaye ngexesha elifanayo, i-LED iyatshisa kwaye iguga. Ukuphilisa ukuphumla kubaluleke kakhulu ekuphuculeni ukuqina kokunamathela kwe-epoxy kunye nesibiyeli (PCB). Iimeko eziqhelekileyo ziyi-120 C, iiyure ze-4. N) Ukukhangela kunye namacwecwe Ekubeni i-LED ixhunyiwe kwimveliso (kungekhona enye), i-LAMP yokupakisha i-LED isebenzisa i-gluten ukusika i-bracket ye-LED. I-SMD-LED ikwibhodi yePCB, ekufuneka ibe ngumatshini wetshiphu ukugqiba umsebenzi wokwahlula. O) Vavanya iiparamitha ze-optoelectronics ze-LED kwaye uvavanye ubungakanani bemilo. P) Ukupakishwa ukubala imveliso egqityiweyo. I-Ultra-high ekhanyayo ye-LED idinga ukupakishwa kwe-anti-static