LED Formal Dress Is Different From LED Inverted

The difference between LED format and LED inverted (1). Solid crystal: The small chip of the formal installation is based on the insulation thermal glue on the inner point of the inner dot of the direct -inserted bracket to fix the chip. The process of crystal is connected to the bracket base, and the bracket base itself is usually a copper material with a high thermal conductivity; (2). Welding line: The format of small chips is usually small and the heat is relatively small, so the heat is relatively small, so it is relatively small, so it is relatively small. Therefore Use positive and negative electrodes to welded oneφ0.8 φThe 0.9mil gold wire is connected to the positive and negative electrodes of the bracket; the driving current of the inverted power chip is generally above 350mA, and the chip size is large. Therefore, in order to ensure the uniformity and stability of the current in injection of the chip, it is usually on the head and negative of the chip. Two welded between the level and the brave pole of the bracket and the bracketφ1.0 φ1.25mil's golden line; (3). Fluorescent powder selection: small chips generally driving currents at about 20mA, while inverted power chips are generally about 350mA. Therefore The popular fluorescent powder in the market is mainly YAG. YAG itself is about 127 C with high temperature resistance. After the chip is lit, the temperature (TJ) will be much higher than this temperature. Therefore, when the heat dissipation is not good, the fluorescent powder is long. Time aging attenuation is severe, so it is recommended to use silicate fluorescent powder with better high temperature resistance during the packaging chip packaging; (4). Collagen choice: small chips with small chips It can meet the needs of the packaging; and the inverted power chip has a large heat and need to be encapsulated with silicone; in order to match the refractive index of the sapphire substrate during the choice of silicone, it is recommended to choose a higher refractive index (> 1.51). To prevent the refractive index from lowering the critical angle of the full reflection, most of the light is lost in the inside of the packaging colloid; at the same time, the silicone elasticity is large, and the thermal stress is much smaller than the epoxy resin compared to epoxy resin than epoxy resin. In the process of use, it can play a good protective role in the chip and the golden line, which is conducive to improving the reliability of the entire product; The method of encapsulation, and during the inverted power chip packaging process, due to the use of flat head brackets, in order to ensure the uniformity of the entire fluorescent powder, it is recommended to use the process of conformal-coating; (6 ). Plastic formation: Positive chip is usually used in the mold to fill the epoxy resin and insert the bracket into the high temperature solidification method; while the inverted power chip needs to be slowly irrigated from one of the intake pores from the lens. The method of filling, during the process of filling, the operation should be improved to avoid baking, cracks, layered and other phenomena after baking; (7). Heating design: Positive chips usually have no extra cooling design; and inverted power power The chip usually needs to add the heat dissipation base plate under the bracket. In special cases, adding a fan after the heat dissipation substrate to heat dissipation; in the process of welding brackets to aluminum substrates, it is recommended to use the temperature of the heating iron iron with the power of the power of the power of the power.