Isinxibo esisesikweni se-LED sahlukile kwi-LED eguqulweyo

Umahluko phakathi kwefomathi ye-LED kunye ne-LED inverted (1). Ikristale eqinileyo: I-chip encinci yokufakela ngokusesikweni isekelwe kwi-insulation glue ye-thermal kwindawo yangaphakathi yechaphaza elingaphakathi le-bracket efakwe ngokuthe ngqo ukulungisa i-chip. Inkqubo ye-crystal ixhunyiwe kwisiseko se-bracket, kwaye isiseko se-bracket ngokwayo ngokuqhelekileyo siyinto yobhedu ene-conductivity ephezulu ye-thermal; (2). Umgca we-Welding: Ifomathi yeetshiphusi ezincinci zihlala zincinci kwaye ubushushu buncinci, ngoko ke ubushushu buncinci, ngoko ke buncinci, ngoko buncinci. Ke ngoko Sebenzisa i-electrode elungileyo kunye nengalunganga kwi-welded enye φ0.8 φI-0.9mil yocingo lwegolide luqhagamshelwe kwii-electrode ezilungileyo kunye ne-negative yesibiyeli; ukuqhubela phambili kwetshiphu yamandla eguqulweyo ingaphezulu kwe-350mA, kwaye ubungakanani betshiphu bukhulu. Ngoko ke, ukwenzela ukuba kuqinisekiswe ukufana kunye nokuzinza kwangoku kwi-injection ye-chip, idla ngokuba sentloko kunye ne-negative ye-chip. Ezimbini zidityaniswe phakathi kwenqanaba kunye nepali ekhaliphileyo yesibiyeli kunye nesibiyeli φ1.0 φ1.25mil intambo yegolide; (3). Ukukhetha umgubo weFluorescent: iitshiphusi ezincinci zihlala ziqhuba imisinga malunga ne-20mA, ngelixa iitshiphusi zamandla eziguqulweyo ziqhelekile malunga ne-350mA. Ke ngoko Umgubo wefluorescent odumileyo kwimarike ikakhulu yi-YAG. I-YAG ngokwayo imalunga ne-127 C kunye nokumelana nobushushu obuphezulu. Emva kokuba i-chip ilayitiwe, ubushushu (TJ) buya kuba phezulu kakhulu kunobu bushushu. Ngoko ke, xa ukutshatyalaliswa kobushushu kungalunganga, i-fluorescent powder ide. Ixesha lokuguga libukhali, ngoko kuyacetyiswa ukuba usebenzise i-silicate fluorescent powder kunye nokumelana nokushisa okuphezulu ngexesha lokupakisha i-chip packaging; (4). Ukhetho lwe-Collagen: ii-chips ezincinci ezinama-chips amancinci Iyakwazi ukuhlangabezana neemfuno zokupakisha; kunye ne-chip ye-inverted power chip inobushushu obukhulu kwaye kufuneka ifakwe nge-silicone; ukuze ufanise isalathiso se-refractive se-sapphire substrate ngexesha lokukhetha i-silicone, kuyacetyiswa ukuba ukhethe isalathisi esiphezulu se-refractive ( > 1.51). Ukuthintela isalathiso se-refractive ekunciphiseni i-angle ebalulekileyo ye-reflection epheleleyo, ininzi yokukhanya ilahlekile ngaphakathi kwi-colloid yokupakisha; ngelo xesha, i-silicone elasticity inkulu, kwaye uxinzelelo lwe-thermal luncinci kakhulu kune-epoxy resin xa kuthelekiswa ne-epoxy resin kune-epoxy resin. Kwinkqubo yokusetyenziswa, inokudlala indima efanelekileyo yokukhusela kwi-chip kunye nomgca wegolide, ohambelana nokuphucula ukuthembeka kwayo yonke imveliso; Indlela yokufaka i-encapsulation, kwaye ngexesha lenkqubo yokupakisha i-chip yamandla eguquliweyo, ngenxa yokusetyenziswa kwezibiyeli zentloko ezisicaba, ukwenzela ukuba kuqinisekiswe ukufana kwayo yonke i powder fluorescent, kucetyiswa ukuba kusetyenziswe inkqubo ye-conformal-coating; ( 6 ). Ukubunjwa kwePlastiki: I-Positive chip idla ngokusetyenziswa kwi-mold ukuze igcwalise i-epoxy resin kwaye ifake i-bracket kwindlela yokuqinisa ukushisa okuphezulu; ngelixa i-chip yamandla eguqulweyo ifuna ukunkcenkceshelwa ngokucothayo ukusuka kwenye yeepore zokungenisa kwi-lens. Indlela yokuzalisa, ngexesha lenkqubo yokuzaliswa, umsebenzi kufuneka uphuculwe ukuze ugweme ukubhaka, ukuqhekeka, ukugqithiswa kunye nezinye izinto emva kokubhaka; (7). Uyilo lokufudumeza: Iichips ezintle zihlala zingenalo uyilo lokupholisa olongezelelweyo; kunye namandla ajikiweyo amandla Itshiphu idla ngokufuna ukongeza ipleyiti esisiseko yokulahla ubushushu phantsi kwesibiyeli. Kwiimeko ezikhethekileyo, ukongeza i-fan emva kwe-substrate yokutshatyalaliswa kobushushu kwi-heat dissipation; kwinkqubo ye-welding brackets kwi-aluminium substrates, kucetyiswa ukuba kusetyenziswe ukushisa kwentsimbi yokufudumeza intsimbi kunye namandla amandla ombane wamandla.