Moaparo o hlophisitsoeng oa LED o fapane le oa inverted ea LED

Phapang pakeng tsa sebopeho sa LED le LED inverted (1). Kristale e tiileng: Chep e nyane ea ho kenya semmuso e thehiloe holim'a sekhomaretsi sa mocheso se kenang ntlheng e ka hare ea letheba le ka hare la bracket e kentsoeng ka kotloloho ho lokisa chip. Ts'ebetso ea kristale e hokahane le setsi sa bracket, 'me setsi sa bracket ka boeona hangata ke thepa ea koporo e nang le conductivity e phahameng ea mocheso; (2). Welding line: Sebopeho sa li-chips tse nyane hangata se nyane mme mocheso o batla o le monyane, kahoo mocheso o batla o le monyane, ka hona o batla o le monyane, ka hona o batla o le monyane. Ka hona Sebelisa li-electrode tse ntle le tse mpe ho tjheseletsa e le 'ngoe φ0.8 φMohala oa khauta oa 0.9mil o hoketsoe ho li-electrode tse ntle le tse mpe tsa borakete; nako ea ho khanna ea chip ea motlakase e khelohileng hangata e ka holimo ho 350mA, 'me boholo ba chip bo boholo. Ka hona, e le ho netefatsa ho ts'oana le botsitso ba hona joale ka ente ea chip, hangata e le hloohong le e mpe ea chip. Tse peli li cheselitsoe pakeng tsa boemo le palo e sebete ea bracket le bracket φ1.0 φkhoele ea khauta ea 1.25mil; (3). Khetho ea phofo ea fluorescent: lichifi tse nyane hangata li khanna maqhubu a ka bang 20mA, athe li-chips tsa motlakase tse khelohileng hangata li ka ba 350mA. Ka hona, phofo e tsebahalang ea fluorescent 'marakeng ke YAG haholo. YAG ka boeona e ka ba 127 C e nang le khanyetso e phahameng ea mocheso. Ka mor'a hore chip e bone, mocheso (TJ) o tla ba holimo haholo ho feta mocheso ona. Ka hona, ha mocheso oa mocheso o sa sebetse, phofo ea fluorescent e telele. Nako ea ho tsofala ha nako e matla, kahoo ho kgothaletswa ho sebelisa silicate fluorescent phofo e nang le mocheso o phahameng oa ho hanyetsa mocheso nakong ea ho paka chip packaging; (4). Khetho ea collagen: li-chips tse nyane tse nang le li-chips tse nyane E ka fihlela litlhoko tsa sephutheloana; 'me chip ea motlakase e kentsoeng e na le mocheso o moholo' me e hloka ho kenngoa ka silicone; e le ho bapisa index ea refractive ea substrate ea safire nakong ea khetho ea silicone, ho kgothaletswa ho khetha index e phahameng ea refractive ( > 1.51). Ho thibela index ea refractive ho theola sekhahla sa bohlokoa sa ponahatso e felletseng, khanya e ngata e lahlehile ka hare ho colloid ea liphutheloana; ka nako e ts'oanang, elasticity ea silicone e kholo, 'me khatello ea mocheso e nyenyane haholo ho feta epoxy resin ha e bapisoa le epoxy resin ho feta epoxy resin. Ha e ntse e sebelisoa, e ka bapala karolo e ntle ea tšireletso ho chip le mohala oa khauta, o loketseng ho ntlafatsa ho tšepahala ha sehlahisoa sohle; Mokhoa oa encapsulation, 'me nakong ea inverted matla chip ambalaji tshebetso, ka lebaka la ho tshebediso ya bataletseng hlooho masakaneng, e le ho etsa bonnete ba ho ts'oana ea kaofela fluorescent phofo, ho kgothaletswa ho sebelisa tshebetso ya conformal-coating; ( 6 ). Sebopeho sa polasetiki: Positive chip e atisa ho sebelisoa ka har'a hlobo ho tlatsa resin ea epoxy le ho kenya bracket ka mokhoa o phahameng oa ho tiisa mocheso; ha chip ea inverted ea matla e hloka ho nosetsoa butle ho tloha ho e 'ngoe ea li-pores tse kenang ho tloha lense. Mokhoa oa ho tlatsa, nakong ea ts'ebetso ea ho tlatsa, ts'ebetso e lokela ho ntlafatsoa ho qoba ho baka, mapetsong, a layered le liketsahalo tse ling ka mor'a ho baka; (7). Moralo oa ho futhumatsa: Hangata li-chips tse ntle ha li na moralo o eketsehileng oa ho futhumatsa; le matla a khelohileng a matla Hangata chip e hloka ho kenya letlapa la motheo la ho qhala mocheso tlas'a borakete. Maemong a khethehileng, ho eketsa fene ka mor'a hore mocheso oa mocheso o fokotsehe ho senya mocheso; ts'ebetsong ea ho kenya li-brackets ho li-substrates tsa aluminium, ho kgothaletswa ho sebelisa mocheso oa tšepe ea tšepe e futhumatsang ka matla a matla a matla a matla a matla.