LED Formal Chipfeko Yakasiyana ne LED Inverted

Musiyano pakati pe LED fomati uye LED inverted (1). Solid crystal: Iyo diki chip yekumisikidzwa kwepamutemo yakavakirwa pane insulation thermal glue panzvimbo yemukati yemukati dot ye yakananga-yakaiswa bracket kugadzirisa chip. Iyo nzira yekristaro yakabatanidzwa kune chigadziko chebhuraketi, uye chigadziko chebhuraketi pachayo chinowanzova chinhu chemhangura chine high thermal conductivity; (2). Welding line: Maumbirwo ediki machipisi anowanzo diki uye kupisa kunenge kudiki, saka kupisa kudiki, saka idiki, saka idiki. Saka Shandisa zvakanaka uye zvisina kunaka electrodes kune welded imwe φ0.8 φIyo 0.9mil goridhe waya yakabatana kune yakanaka uye yakaipa electrode yebhureki; iko zvino kutyaira kweiyo inverted simba chip kazhinji iri pamusoro pe350mA, uye saizi yechip yakakura. Nokudaro, kuitira kuti uve nechokwadi chekufanana uye kugadzikana kwezvino mujekiseni ye chip, inowanzova pamusoro uye isina kunaka kwechip. Maviri akasungwa pakati pechinhanho nedanda rakashinga rebhuraketi nebhureketi φ1.0 φ1.25mil tambo yegoridhe; (3). Fluorescent poda kusarudzwa: machipisi madiki anowanzo kutyaira mafungu paanenge 20mA, nepo inverted magetsi machipisi anowanzo kuita 350mA. Naizvozvo Iyo yakakurumbira fluorescent poda pamusika inonyanya kuve YAG. YAG pachayo inenge 127 C ine yakanyanya tembiricha kuramba. Mushure mekunge chip yabatidzwa, tembiricha (TJ) ichave yakanyanya kudarika tembiricha iyi. Nokudaro, kana kupisa kwekushisa kusina kunaka, iyo fluorescent powder yakareba. Nguva yekuchembera attenuation yakanyanya, saka zvinokurudzirwa kushandisa silicate fluorescent poda ine nani yakakwira tembiricha kuramba panguva yekurongedza chip packaging; (4). Collagen sarudzo: madiki machipisi ane madiki machipisi Inogona kusangana nezvinodiwa zvekurongedza; uye inverted simba chip ine kupisa kukuru uye inoda kuvharwa nesilicone; kuitira kuti ienderane nerefractive index yesafiro substrate panguva yekusarudza silicone, zvinokurudzirwa kusarudza yakakwira refractive index ( > 1.51). Kuti udzivise refractive index kubva pakudzikisa kona yakakosha yekuratidzira kwakazara, yakawanda yechiedza inorasika mukati mekuvhara colloid; panguva imwecheteyo, iyo silicone elasticity yakakura, uye kushushikana kwekushisa kwakanyanya kuduku kudarika epoxy resin kana ichienzaniswa ne epoxy resin kupfuura epoxy resin. Mukushandiswa kwekushandiswa, inogona kuita basa rakanaka rekudzivirira mu chip uye mutsara wegoridhe, iyo inobatsira kuvandudza kuvimbika kwechigadzirwa chose; Iyo nzira yekuisa encapsulation, uye panguva inverted simba chip packaging process, nekuda kwekushandiswa kwemabhuraketi emusoro, kuitira kuti ive nechokwadi chekufanana kwehupfu hwefluorescent, zvinokurudzirwa kushandisa maitiro e-conformal-coating; (6 ). Kuumbwa kwePlastiki: Positive chip inowanzo shandiswa mu mold kuzadza epoxy resin uye kuisa bhuraketi muyepamusoro tembiricha yekusimbisa nzira; nepo inverted simba chip inoda kudiridzwa zvishoma nezvishoma kubva kune imwe yekutora pores kubva kune lens. Nzira yekuzadza, panguva yekuzadza, kushanda kunofanira kuvandudzwa kudzivirira kubheka, kuputika, kuputika uye zvimwe zviitiko mushure mekubika; (7). Kupisa dhizaini: Positive machipisi kazhinji haana yakawedzera kutonhora dhizaini; uye inverted simba simba Iyo chip inowanzoda kuwedzera kupisa kwekupisa base plate pasi pebhuraketi. Muzviitiko zvakakosha, kuwedzera fan mushure mekupisa kupisa substrate kune kupisa kupisa; mukugadzirisa mabhureki emagetsi kune aluminium substrates, zvinokurudzirwa kushandisa tembiricha yekupisa simbi ine simba resimba resimba resimba.