I-LED Formal Dress Ihlukile Kokuguquliwe Kwe-LED

Umehluko phakathi kwefomethi ye-LED ne-LED ehlanekezelwe (1). Ikristalu eqinile: I-chip encane yokufakwa okusemthethweni isekelwe ku-insulation glue eshisayo endaweni yangaphakathi yechashazi elingaphakathi likabakaki oqondile ofakwe ukulungisa i-chip. Inqubo ye-crystal ixhunywe kusisekelo sebakaki, futhi isisekelo se-bracket ngokwayo ngokuvamile siyinto yethusi ene-conductivity ephezulu yokushisa; (2). Umugqa wokushisela: Ifomethi yama-chips amancane ngokuvamile incane futhi ukushisa kuncane, ngakho-ke ukushisa kuncane, ngakho-ke kuncane kakhulu, ngakho-ke kuncane kakhulu. Ngakho-ke Sebenzisa ama-electrode aqondile noma angalungile kulowo oshiselwe φ0.8 φIntambo yegolide engu-0.9mil ixhunywe kuma-electrode ephozithivu nenegethivu kubakaki; amandla okushayela e-chip yamandla ahlanekezelwe ngokuvamile angaphezulu kuka-350mA, futhi usayizi we-chip mkhulu. Ngakho-ke, ukuze kuqinisekiswe ukufana nokuzinza komjovo wamanje we-chip, kuvame ukuba sekhanda kanye ne-negative ye-chip. Amabili ashiselwe phakathi kwezinga nesigxobo esinesibindi sikabakaki kanye nobakaki φ1.0 φulayini wegolide we-1.25mil; (3). Ukukhethwa kwempushana ye-fluorescent: ama-chips amancane ngokuvamile ashayela imisinga cishe ku-20mA, kuyilapho ama-chips amandla ahlanekezelwe ngokuvamile angaba ngu-350mA. Ngakho-ke Impushana ye-fluorescent ethandwayo emakethe ikakhulukazi i-YAG. I-YAG ngokwayo icishe ibe ngu-127 C enokumelana nokushisa okuphezulu. Ngemuva kokuthi i-chip ilayishiwe, izinga lokushisa (TJ) lizoba phezulu kakhulu kunalokhu kushisa. Ngakho-ke, lapho ukushisa kokushisa kungalungile, i-fluorescent powder yinde. Isikhathi sokuguga sinzima kakhulu, ngakho-ke kunconywa ukusebenzisa i-silicate fluorescent powder enokumelana okungcono kakhulu kwezinga lokushisa ngesikhathi sokupakishwa kwe-chip; (4). Ukukhetha kwe-Collagen: ama-chips amancane anama-chips amancane Angakwazi ukuhlangabezana nezidingo zokupakisha; futhi i-chip yamandla ehlanekezelwe inokushisa okukhulu futhi idinga ukumbozwa nge-silicone; ukuze ufanise inkomba ye-refractive ye-sapphire substrate ngesikhathi sokukhethwa kwe-silicone, kunconywa ukuba ukhethe inkomba ephakeme ye-refractive ( > 1.51). Ukuze uvimbele inkomba ye-refractive ekunciphiseni i-engeli ebalulekile yokubonisa okugcwele, ukukhanya okuningi kulahleka ngaphakathi kwe-colloid yokupakisha; ngesikhathi esifanayo, ukuqina kwe-silicone kukhulu, futhi ukucindezeleka kokushisa kuncane kakhulu kune-epoxy resin uma kuqhathaniswa ne-epoxy resin kune-epoxy resin. Enkambweni yokusetshenziswa, ingadlala indima enhle yokuvikela ku-chip kanye nomugqa wegolide, okulungele ukuthuthukisa ukuthembeka komkhiqizo wonke; Indlela ye-encapsulation, futhi ngesikhathi senqubo yokupakisha i-chip yamandla eguquliwe, ngenxa yokusetshenziswa kwamabakaki ekhanda eliyisicaba, ukuze kuqinisekiswe ukufana kwayo yonke impushana ye-fluorescent, kunconywa ukusebenzisa inqubo yokuhlanganisa-conformal-coating; ( 6 ). Ukwakheka kwePlastiki: I-Positive chip ivame ukusetshenziswa esikhunjeni ukugcwalisa i-epoxy resin futhi ifake ubakaki endleleni yokuqinisa izinga lokushisa eliphezulu; kuyilapho i-chip yamandla ehlanekezelwe idinga ukuniselwa kancane kancane isuka kwenye yezimbotshana zokungenisa ezisuka kulensi. Indlela yokugcwalisa, phakathi nenqubo yokugcwalisa, ukusebenza kufanele kuthuthukiswe ukuze kugwenywe ukubhaka, ukuqhekeka, ungqimba kanye nezinye izenzakalo ngemva kokubhaka; (7). Umklamo wokushisa: Ama-chips amahle ngokuvamile awanawo umklamo wokupholisa owengeziwe; namandla wamandla ahlanekezelwe I-chip ivamise ukudinga ukwengeza ipuleti eliyisisekelo lokulahla ukushisa ngaphansi kukabakaki. Ezimweni ezikhethekile, ukwengeza i-fan emva kwe-substrate yokushisa ukushisa ekushiseni ukushisa; enkambweni yokushisela amabakaki ku-aluminium substrates, kunconywa ukusebenzisa izinga lokushisa lensimbi yokushisa ngamandla amandla wamandla wamandla.