Labbiska rasmiga ah ee LED wuu ka duwan yahay LED-ka rogan

Farqiga u dhexeeya qaabka LED-ka iyo LED-ka rogan (1). crystal adag: Chip yar ee rakibaadda rasmiga ah waxay ku salaysan tahay xabagta kulaylka dahaadhka barta gudaha ee dhibicda gudaha ee garabka tooska ah -la geliyo si loo hagaajiyo chip. Habka crystal wuxuu ku xiran yahay saldhigga saldhigga, iyo saldhigga laftiisa laftiisa ayaa badanaa ah walxo naxaas ah oo leh kororka kuleylka sare; (2). Xariiqda alxanka: Habka jajabyada yaryar badanaa waa yar yihiin kulaylkuna waa yar yahay, markaa kulaylku waa yar yahay, sidaas awgeed waa yar yahay, sidaas awgeed waa yar yahay. Sidaa darteed Isticmaal koronto-yaal togan iyo kuwa taban si aad mid u alxanto φ0.8 φSiliga dahabka ah ee 0.9mil wuxuu ku xiran yahay korantada togan iyo kuwa taban ee xirmada; dawaynta hadda ee quwadda rogan ayaa guud ahaan ka sarraysa 350mA, cabbirkuna waa weyn yahay. Sidaa darteed, si loo hubiyo isku-duubnaanta iyo xasilloonida hadda jirta ee duritaanka chip-ka, waxay badanaa ku jirtaa madaxa iyo taban ee chip-ka. Laba welded inta u dhaxaysa heerka iyo tiirka geesiga ah ee birta iyo shafka φ1.0 φxariiqda dahabka ah ee 1.25mil; (3). Xulashada budada fluorescent: chips yar yar guud ahaan wadista qulqulka ilaa 20mA, halka jajabyada korantada rogan ay guud ahaan yihiin 350mA. Sidaa darteed budada fluorescent ee caanka ah ee suuqa ku jirta ayaa u badan YAG. YAG lafteedu waxay ku saabsan tahay 127 C oo leh iska caabin heerkul sare ah. Ka dib marka la shido chip-ka, heerkulka (TJ) aad ayuu uga sarreeyaa heerkulkan. Sidaa darteed, marka kulaylku aanu fiicnayn, budada fluorescent waa mid dheer. Hoos u dhigista gabowgu waa mid daran, sidaas darteed waxaa lagu talinayaa in la isticmaalo budada fluorescent silicate oo leh iska caabin heerkul sare oo ka wanaagsan inta lagu jiro baakooyinka baakadaha; (4). Doorashada Collagen: Chips yar yar oo leh jajabyo yaryar Waxay dabooli kartaa baahiyaha baakadaha; iyo quwadda korantada rogan waxay leedahay kuleyl weyn oo u baahan in lagu daboolo silikoon; Si loo waafajiyo index refractive substrate sapphire inta lagu guda jiro doorashada silikoon, waxaa lagu talinayaa in la doorto index refractive sare ( > 1.51). Si looga hortago tusaha dib-u-celinta inuu hoos u dhigo xagasha muhiimka ah ee milicsiga buuxa, inta badan iftiinka ayaa ku dhex lumay gudaha baakadaha kolloid; Isla mar ahaantaana, barti silikoon waa weyn yahay, iyo stress kulaylku aad ayuu uga yar yahay xabagta epoxy marka la barbar dhigo epoxy resin ka epoxy. Habka isticmaalka, waxay ka ciyaari kartaa door wanaagsan oo ilaalin ah oo ka mid ah jajabka iyo xariiqda dahabiga ah, taas oo ku habboon hagaajinta kalsoonida alaabta oo dhan; Habka isku-xidhka, iyo inta lagu jiro habka baakadaha awoodda rogan, sababtoo ah isticmaalka xargaha madaxa ee fidsan, si loo hubiyo isku-dhafka dhammaan budada fluorescent, waxaa lagu talinayaa in la isticmaalo habka isku-dhafka ah; (6). Samaynta caaga ah: Chip togan ayaa sida caadiga ah loo isticmaalaa caaryada si loo buuxiyo resin epoxy-ga oo la geliyo xidhmada habka xoojinta heerkulka sare; halka jajabka korantada rogan uu u baahan yahay in si tartiib ah looga waraabiyo mid ka mid ah daloolada qaadashada ee muraayada. Habka buuxinta, inta lagu jiro habka buuxinta, qalliinka waa in la hagaajiyaa si looga fogaado dubista, dildilaaca, lakabka iyo dhacdooyinka kale ee dubista ka dib; (7). Naqshad kuleylinta: Chips-ka wanaagsan sida caadiga ah ma laha naqshad qaboojin dheeraad ah; iyo awoodda korantada rogan Chip inta badan wuxuu u baahan yahay inuu ku daro saxanka sal-dhigida kulaylka hoostiisa. Xaalado gaar ah, ku darida marawaxada ka dib kuleylka kuleylka kuleylka kuleylka; Inta lagu jiro habka alxanka alxanka ee aluminiumka aluminiumka, waxaa lagu talinayaa in la isticmaalo heerkulka birta birta kuleyliyaha leh awoodda awoodda awoodda awoodda.