ODM/OEM services of various air and water disinfection modules and overall UV LED(UVA.UVB.UVC.UVV) solution provider.


COB packaging technology is to fix the LED chip on the high thermal conductivity metal substrate or ceramic substrate, and reduce the thermal resistance through the direct heat dissipation of the substrate, which has a good heat dissipation effect.
Main applications: Cable crosslinking curing, high-speed printing curing, glue curing, inkjet printing, 3D printing, exposure machine, etc.
Important parameters: 365nm, 385nm, 395nm, 405nm, 415nm.
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