ODM/OEM services of various air and water disinfection modules and overall UV LED(UVA.UVB.UVC.UVV) solution provider.

LED Board

Features: COB packaging technology is to fix the LED chip on the high thermal conductivity metal substrate or ceramic substrate, and reduce the thermal resistance through the direct heat dissipation of the substrate, which has a good heat dissipation effect.
Main applications: phototherapy, physiotherapy, calcium and vitamin D supplementation, plant growth, skin treatment, light curing of special materials, etc.
Important parameters: 310nm.
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