What Does COB Packaging Mean? What Are the Differences From Traditional Packaging

What is COB encapsulated Cache on Board ) Bangbang is set on the printed board. As IC suppliers are reducing QFP (a encapsulation method of SMT parts) packaging in LCD control and the production of related chips. Therefore, the traditional SMT method in future products is gradually replaced. The difference between COB packaging technology and traditional packaging? COB packaging is the package that binds the LED chip directly on the PCB board. What are the differences between this packaging method and traditional SMD LED and other packaging techniques, and which one is better? The comparison of these two packaging methods? There are two main forms of nude chip technology: one is COB technology, and the other is FLIP Chip technology (FLIP Chip). LED COB packaging technology The so -called COB is to adhere the nude chip with conductive or non -conductive adhesion on the interconnected substrate, and then perform the lead key to achieve its electrical connection. If the naked chip is directly exposed to the air, it is susceptible to pollution or artificial damage, affecting or destroying the function of the chip, so the chip and key lead are sealed with glue. People also call this form of packaging as a soft bag. The nude chip encapsulated with COB technology is the chip main body and I/O terminals above the crystal. During the welding, the nude chip is adhesive to PCB with conductive/thermal glue. After solidification ) Under the action of ultrasound and thermal pressure, connect to the chip's I/O terminal welding area and the corresponding pads of PCB, respectively. After the test is passed, the resin glue is sealed. Compared with traditional packaging technology, COB technology has the following advantages: low price; space savings; mature craftsmanship. LED COB packaging technology is also insufficient, that is, a separate welding machine and a packaging machine are needed. Sometimes the speed can not keep up with PCB patch stringent requirements for the environment; it cannot be maintained. COB, this traditional packaging technology will play an important role in the packaging of portable products. Common problems of LED COB packaging technology Q: LED light source COB packaging process Mid -color temperature offset problem. When COB packaging is used in COB packaging, it uses traditional high -power packaging process. After baking, it is found that the color temperature is always too large. , 5000K in the preliminary point, but the glue powder is 10000K after the grill is grilled. Is it the problem of the baking process of silicone or the glue powder is not suitable. Please everyone! A: The baking temperature is too high, and the electrode distance becomes too close. Shorten the time of the spray to the baking time. The color temperature difference should be caused by the fluorescent powder. Quickly hardening to avoid fluorescence powder! Review the heating curve of the Oven box Q: What is the difference between LAMP LED packaging technology and COB packaging in the packaging technology of LED? Both are direct -inserted instead of patch packaging. What is the difference? What are the aspects? Is one suitable for high power, one for small power? A: COB technology is generally more applicable to the same substrate with other electronic components. If the LED COB is made into a direct encapsulation package, it should be a module with some special functions such as flash function or digital character, color control module, etc. Both large and small power can be COB or LAMP. There is no difference in this aspect. Q: May I ask COB integrated packaging as a plane light source, will it replace the current patch products? A: No replacement, both are in the future development, and both will coexist for a long time.