What Is an LED Chip?

What is an LED chip? What are its characteristics? The LED chip manufacturing is mainly to create an effective and reliable low Ohm contact electrode, and can meet the smaller voltage drops between accessible materials and provide the pads of welding lines. At the same time. Vacuum steam plating methods are generally used for cross -membrane process. 4Pa is high and vacuum. Under high vacuum, use resistor heating or electronic beam heating methods to melt the material. Shenzhen LED chip, and under low air pressure, BZX79C18 becomes metal vapor deposits on the surface of the material on the surface of the material. Generally used P -type contact metals including AUZN, AUZN and other alloys. The contact metal on the N side often uses AUGENI alloy. The alloy layer formed after coating also needs to be exposed as much as possible through the optical carvings process, so that the left -left alloy layer can meet the requirements of effective and reliable low ohm contact electrodes and welded pads. After the lithography process is over, it must be passed through the alloyization process, and the alloyization is usually under the protection of H2 or N2. The time and temperature of the alloy is usually determined according to factors such as material characteristics and the form of alloy furnace. Of course, if the electrode process of blue and green and other chips is complicated, it is necessary to increase the growth of passivation film, plasma etching process, etc. LED chip classification——What are the classifications of GB chips and LED chips? GB chip definition and characteristics 1. Definition: Glue bonding chip; this chip belongs to UEC's special i -benefit product. 2. Features: (1) The transparent sapphire base replaces the suction GAAS substrate. Its output power is more than twice the traditional AS (ABSORBable Structure) chip. (2) The chip is glowing on all sides, with excellent Pattern diagram. (3) In terms of brightness, how much LED chip is, its overall brightness has exceeded the level of TS chip (8.6mil). (4) Dual -electrode structure, its high current resistance should be slightly worse than the TS single -electrode chip. LED chip size is divided into small power chips, medium -power chips and high -power chips according to power can be divided into small power chips. According to customer requirements, it can be divided into single -tube level, digital level, dot matrix level, decoration lighting and other categories. As for the specific size of the chip, it depends on the actual production level of different chip manufacturers. There is no specific requirements. As long as the process passes, small chips can increase the output of the unit and reduce the cost. The use current of the chip is actually related to the current density of flowing through the chip. The chip uses small currents small current, the chip ambassador has a large current, and their unit current density is basically similar. Considering that heat dissipation is the main problem under large current, LED chip manufacturers, so its luminous efficiency is lower than small current. On the other hand, due to the increase in area, the body resistance of the chip will decrease, so the positive direction voltage will decrease.