Yintoni iChip ye-LED?

Yintoni itshiphu ye-LED? Ziziphi iimpawu zayo? Ukwenziwa kwe-chip ye-LED ikakhulu kukudala i-electrode esebenzayo kunye nethembekileyo ephantsi ye-Ohm yoqhagamshelwano, kwaye inokuhlangabezana nokuhla kombane omncinci phakathi kwezinto ezifikelelekayo kunye nokubonelela ngeepadi zemigca ye-welding. Kwangaxeshanye. Iindlela zokucola umphunga wevacuum zisetyenziswa ngokubanzi kwinkqubo ye-cross-membrane. I-4Pa iphezulu kunye ne-vacuum. Ngaphantsi kwe-vacuum ephezulu, sebenzisa ukufudumeza kwe-resistor okanye iindlela zokufudumeza ze-elektroniki ukunyibilikisa izinto. Itshiphu ye-Shenzhen LED, kwaye phantsi koxinzelelo lomoya oluphantsi, i-BZX79C18 iba ziidipozithi zomphunga wesinyithi kumphezulu wezinto ezibonakalayo. Ngokuqhelekileyo kusetyenziswa i-P-type contact metals kubandakanya i-AUZN, i-AUZN kunye nezinye i-alloys. Intsimbi yokudibanisa kwicala le-N ihlala isebenzisa i-AUGENI ialloy. Umaleko we-alloy owenziwe emva kokugquma kwakhona kufuneka utyhileke kangangoko kunokwenzeka ngenkqubo ye-optical carvings, ukwenzela ukuba umaleko we-alloy wasekhohlo unokuhlangabezana neemfuno ze-electrode zoqhagamshelwano ezisebenzayo nezithembekileyo ze-ohm kunye neepads ezidibeneyo. Emva kokuba inkqubo ye-lithography iphelile, kufuneka idluliselwe kwinkqubo ye-alloyization, kwaye i-alloyization ngokuqhelekileyo iphantsi kokukhuselwa kwe-H2 okanye i-N2. Ixesha kunye nokushisa kwe-alloy ngokuqhelekileyo kugqitywa ngokwezinto ezifana neempawu zezinto eziphathekayo kunye nefom yesithando somlilo we-alloy. Ngokuqinisekileyo, ukuba inkqubo ye-electrode eluhlaza okwesibhakabhaka kunye nohlaza kunye nezinye iitshiphusi zinzima, kuyimfuneko ukunyusa ukukhula kwefilimu ye-passivation, inkqubo ye-plasma etching, njl. Ukuhlelwa kwe-chip ye-LED —— Luluphi ukuhlelwa kweetshiphusi ze-GB kunye neetshiphusi ze-LED? Inkcazo yetshiphu ye-GB kunye neempawu 1. Ingcaciso: I-Glue bonding chip; le chip yeyemveliso ye-UEC ekhethekileyo ye-i-benefit. 2. Iimpawu: (1) Isiseko sesafire esicacileyo sithatha indawo ye-suction GAAS substrate. Amandla ayo emveliso angaphezulu kabini kwe-AS yemveli (ABSORBable Structure) chip. (2) Itshiphu iyamenyezela macala onke, inePateni egqwesileyo idayagram. (3) Ngokumalunga nokukhanya, ingakanani i-chip ye-LED, ukukhanya kwayo ngokubanzi kudlule inqanaba le-TS chip (8.6mil). (4) Isakhiwo se-electrode ephindwe kabini, ukuchasana kwayo okuphezulu kwangoku kufuneka kube kubi kancinci kune-TS enye -i-electrode chip. Ubungakanani be-chip ye-LED bohlulwe ngokweetshiphusi ezincinci zamandla, iitshiphusi zamandla aphakathi kunye ne-high-power chips ngokwamandla zinokwahlulwa zibe ziichips ezincinci zamandla. Ngokweemfuno zabathengi, inokwahlulwa ibe yinqanaba le-tube enye, inqanaba ledijithali, inqanaba lematrix yamachaphaza, ukukhanya komhombiso kunye nezinye iindidi. Ngokubhekiselele kubungakanani obuthile be-chip, kuxhomekeke kwinqanaba lokwenyani lemveliso yabenzi beetshiphu ezahlukeneyo. Akukho mfuneko zikhethekileyo. Ngethuba nje inkqubo idlula, iitshiphusi ezincinci zinokunyusa imveliso yeyunithi kwaye zinciphise iindleko. Ukusetyenziswa kwangoku kwetshiphu eneneni inxulumene noxinaniso lwangoku lokuqukuqela kwitshiphu. I-chip isebenzisa imisinga emincinci yangoku, i-ambassador ye-chip inomsinga omkhulu, kunye noxinano lweyunithi lwangoku lufana ngokusisiseko. Ukuqwalasela ukuba ukutshatyalaliswa kobushushu kuyingxaki ephambili phantsi kwangoku okukhulu, abavelisi be-chips be-LED, ngoko ke ukusebenza kwayo okukhanyayo kuphantsi kunencinci yangoku. Ngakolunye uhlangothi, ngenxa yokunyuka kwendawo, ukuxhathisa umzimba we-chip kuya kuncipha, ngoko i-voltage ye-positive direction iya kuncipha.