Why Does the UVLED Chip Packaging Welding Use a Vacuum Return Furnace Process?

The emergence of UVLED is a revolutionary change in the UV industry. Its light intensity is constant, with excellent temperature control, environmentally friendly and portable. First of all, the service life of the ultraviolet curing system is longer than the traditional UV solidification 800-3000 hours, up to 20,000-30000 hours, the mercury lamp starts slowly, which directly affects the life of the bulb. Bright, not only low loss, but also more energy saving. Secondly, the traditional mercury lamp shines, and who contains the silver in the light bulb, improper use will cause severe pollution to the environment, and even affect people's life and health. The LED lamp beads use semiconductor lighting, which does not contain harmful substances, and will not cause pollution to the environment. In addition, when the traditional mercury lamp method ultraviolet rays are used, the surface temperature of the exposure product will be as high as 60-90 C, which will easily cause product displacement and deformation. When the LED is used, there is no infrared ray. In the following, it will not radiate to the product, making the product performance more stable. In summary, UVLED is a future development trend, but there are also some shortcomings at UVLED. The light power density is insufficient, which affects UV inks to curing the speed. Therefore The group reliability is poor, which makes UVLED leading to a lot of difficulty in the promotion. The vacuum return furnace process of UVLED chip packaging welded and welding appeared at the time. It could reduce the hollow rate of high -power UVLED chip to within 3%. At the same time, if the design of heating substrate with water cold during design, it can make the heat dissipation cooling and more efficient, thereby It greatly improves the reliability of high -power UVLED, and can open the road for UVLED in many areas in the future.