What Is the Chip Suitable for High -power LEDs?

It is a tricky issue for some LED manufacturers and customers to choose a high -power LED chip and choose the appropriate high -power LED chip. We have specifically summarized some methods for your reference. First: increase size method. Increase the effective single -featured LED light -emitting area, promote the uniform distribution of the current of the TCL layer, and the specially designed electrode structure (usually combed electrodes) to achieve an increase in the size of the expected magnetic flow flow. However, simply increasing the lighting area cannot solve the problem of heat consumption and light of fundamental problems, and cannot achieve the expected effect welding and actual application. Second: Silicon bottom plate reverse method. First of all, there must be a large -sized LED chip suitable for common crystal welding electrodes. At the same time, prepare the corresponding size silicon base, produce gold co -crystal welded layer and conductive conductive layer (ultrasonic golden ball connector). Then, the large -sized LED chip of the common crystal welding equipment is welded with silicon substrate welding together. This structure is more reasonable, that is, the problem of lighting, and the heat dissipation problem has been considered. Third: Sapphire substrate transition method. After the PN knot of the sapphire substrate according to the traditional method, remove the Ingan chip growing on the sapphire substrate, and then connect to the traditional four -yuan material to create a large -size blue LED chip with a superior electrode structure. Fourth: Ceramic bottom plate reverse method. First use the LED chip factory general device to generate a large -scale light LED chip suitable for common crystal welding electrode structure and the corresponding ceramic floor and the co -crystal tin conduitment layer of production. Use a large -sized LED chip to welded with a large -sized LED chip in the common crystal welding equipment. This structure takes into account the problem of light, and considers the heat dissipation problem, and uses high heat -conducting ceramic plates, ceramic plates, and the heat dissipation effect is very good, and the price is relatively low. Therefore, it is more suitable for the current substrate. Installation space is left.