Ukonyuka koBuqondo bokuchasana noLwakhiwo lweDiode yokukhanya

Isibane se-LED sigalela iitshiphusi, izakhono ezingapakishwanga kutshanje zibangele ishishini lobugcisa obuphezulu kushishino lwe-LED. Ngenxa yobuhlalu besibane sesibane se-LED, inkqubo yokwakheka kokubunjwa kokutshatyalaliswa kobushushu, ukungaphumeleli kokukhanya kunye nezinye iibhotile zezakhono. LED isibane bead egalela chips kunye nezakhono ezingapakishwanga kwangethuba kwiminyaka eli-10 eyadlulayo, amazwe angaphandle utyalo-mali kuphando enkulu eyinkunzi. Ijolise kwi-LED amaso isibane ukusuka substrate glue kunye okuziinkozo izakhono welding ngqo. Ipheliswe ngokupheleleyo ngamaso isibane LED chips ngokusesikweni kwinkangeleko izifo ezininzi iinwele, ukuvumela amaso isibane LED ukumelana nokunyamezelana ubushushu eliphezulu kunye nokwandisa amaso isibane LED. Ushishino luphezu kwezakhono zokusika zokupakishwa kwamaso wesibane se-LED. & LED Lighting Daspeed Zingaphi wnbsp; kodwa umbuzo ngulo: Kutheni izakhono zokugalela isibane sesibane se-LED? Ukuxhomekeka kwi-aluminium (ubhedu) substrates, ukubunjwa kwe-ceramic substrate processing, kunye nofakelo alukho lula njenge-metal substrates, kuba (kabini) i-tin welding kufuneka imelane ne-280 degrees yokushisa okuphezulu, okungenakukunceda kodwa kubangele umonakalo kwizinto eziphathekayo kunye namacandelo. I-Ceramic substrates kunye ne-metal substrates ayiphezulu kunezinga lokubonisa, kwaye umphumo wokukhanya odlulayo kunzima ukuphucula. Umyinge olinganiselweyo wokuqhuba ubushushu bee substrates zeceramic kunye nendawo yoqhagamshelwano yetshiphu elinganiselweyo nayo ithintele isiphumo sayo sokukhanya esizinzileyo. Inkqubo yokugalela isibane sesibane se-LED kabini kwi-tin welding kunye ne-ceramic substrate aluminiyam substrate ukuxhathisa ubushushu obumbini kwanele ukuphelisa umoya ongentla okhankanywe. Ukongeza, i-welding yoxinzelelo lobushushu kunye ne-reflux ye-welding yeentsimbi zesibane se-LED ziphezulu kakhulu, kwaye isivuno asizinzile. Ngokombono wabasebenzisi bokugqibela, isixhobo esihle se-LED kufuneka sibe nomgangatho wokukhanya ongcono, imisebenzi yokukhanyisa ephezulu, iindleko zenkqubo ephantsi kunye nembuyekezo yotyalo-mali ngokukhawuleza. Ukubamba isibane isibane LED ubuchule ukugalela kwixa elizayo (LM yuan) ixabiso. Ngandlel 'ithile, izakhono zokupakisha zezibane ze-LED luphuhliso kunye nezakhono zokuvelisa izibiyeli zokupakisha. I-COB ye-LED yesibane se-bead encapsulation kunye ne-single-chip ye-LED yesibane se-bead packaging ibonise amandla amaninzi ngokumalunga nokukhanya okunamandla, ukutshatyalaliswa kobushushu, ukusabalalisa ukukhanya, iindleko, njl. Izibane zesibane ze-COB ze-LED zendabuko ngoku ziyi-bracket esebenzisa i-aluminium (okanye i-copper) substrates ukudibanisa i-FR4 fiber board ibe nye. I-Domestic FR-4 iipilisi ze-semi-curing, i-conductivity ye-thermal kuphela yi-0.3 / m-k, eyona nto yokungena i-2.0 / m-k kuphela kumrhwebi, ngelixa i-coefficient yokufudumala ye-aluminium ecocekileyo yi-237 / m-k. Kufuneka ikhulise ukuxhathisa ubushushu benkqubo, kubangela ukuba amaso isibane esibukhali se-LED sibole kwaye sinciphise ubomi benkonzo. Ke ngoko, iingqondo zengqondo zabantu ziyayiphelisa i-fiber yokugquma ye-aluminium substrates. “Isibiyeli se-LMCOB ”(Ukumba isikhumba sobhedu kunye ne-insulating layer ye-aluminium substrate), kodwa inqunyelwe kwisizathu sezixhobo, i-gel, inkqubo kunye neendleko, kwaye akukanyuswa. Ukongeza, imarike yangoku ithandwa ngokubanzi ebizwa “Umthombo wokukhanya odibeneyo ”Isifundiswa, esamkela inkqubo yokubumba inaliti yokufaka ipleyiti ye-electrode kwiPPA (okanye i-EMC etyhalayo ngoku), kuba iPPA iya kuba ngumgubo omthubi phantsi kobushushu obuphezulu kunye nemitha ye-ultraviolet, ekhokelela kumanzi aphefumlayo kunye namanzi. Uyilo kungenxa yokuba ipleyiti ye-electrode iphezulu kune-chip 1.5 udade, kwaye umgubo wayo we-fluorescent kunye nedosi yejeli zindala kakhulu. Ayizokwandisa kuphela iindleko zokupakisha, ii-colloids ezishinyene kakhulu ziya kuchaphazela ukuhanjiswa. Okwangoku, zonke izibiyeli zezibane ze-COB ze-LED azinamkhethe ukuseta uyilo lwendawo evalelekileyo ukuze zithintele iintsini zokubhideka kwe-fluorescent ngaphandle kokuchitheka, kuba ijeli yedama kunye nomphezulu omhlophe ofunxa ukukhanya kweoli. Ekuqaleni, ubunzulu bokukhanya kunye nobushushu bokudluliselwa kwesixeko sisizathu esibalulekileyo sesiphumo sokukhanya okwethutyana komthombo wokukhanya wesibane se-COB ye-LED kunye nobunzima bokukhanya okuzinzileyo. Kuyilo lwezibane zezibane ze-LED, umbuzo oqhelekileyo obuzwayo we-5052LED we-bead yesibane yindlela yokukhetha unikezelo lwamandla okuqhuba, kwaye ngokwenene amaso wesibane se-LED awisiwe okanye atshatyalalisiwe, kwaye umlinganiselo wamandla okuqhuba ufanelekile. Izakhono zokukhanyisa amaso ibhodi emfutshane. Nangona kunjalo, izibane ze-COB ze-LED ze-aluminium substrates zamkele ukupakishwa kwe-decentralized layout yamandla okushisa, kwaye (i-chip ichazwe ngokuthe ngqo kwi-substrate).