Ultra -power LED Lamp Bead Encapsulation Requires LED Lamp Beads and Technology

& nbspled lamp beads 1s1; LED lamp bead's craft design package pregnancy chip design and chip packaging. At present, the packaging technology of the power LED lamp beads and its heat dissipation technology are the hotspots of today's society research. Because the power of the power LED lamp beads is relatively simple to say, the actual process is long and complicated. And LED lamp bead packaging technology directly affects the acceptance life of LED lamp beads. Therefore, in the process of power LED lamp beads packaging, many factors must be considered, like many factors such as light, heat, electricity, machinery, etc. In terms of optics, we must consider the problem of light decay of power LED lamp beads and thermal science. The heat dissipation problem of the power LED lamp beads, and the electrical aspects must be considered. During the packaging process, the packaging situation of LED lamp beads, etc. The advantages of long -term power LED lamp beads have the advantages of long life, low pollution, low power consumption, energy saving, and impact resistance. Compared with the traditional Zhaoxing, the power LED lamp beads are not only good monochrome, high optical efficiency, and strong light effects, but also meet the difference in different color rendering indexes. Despite Yunyun, the packaging process of the power LED lamp beads has strict requirements. The following features are following: 1. Low cost; 2. The most late -year -older system efficiency; 3. Easy replacement and maintenance; 4. Multiple LED lamp beads can be modularized; 5. High heat dissipation coefficients are high. According to the various factors that the power LED lamp bead encapsulation technology needs to be considered, some points have been proposed in terms of key technologies. Important package pregnancy: 1. In terms of power LED lamp bead heat dissipation: Considering low thermal resistance packaging. LED lamp bead chip is a solid semiconductor device, the focus department of LED lamp bead light source. Due to the large details of the power LED lamp chip chip, and in the driver form, the constant -driven pattern is accepted. You can directly convert the power energy into light energy. The LED lamp chip needs to receive the input department of electrical energy in the process of lighting. In this process, it will produce very calories. Therefore, the cooling technology of the power LED lamp chip for the year of the year is the main technology of the LED lamp bead packaging process. The heart of LED lamp beads is a semiconductor chip. One end of the chip is attached to a bracket, one end is a negative electrode, and the other end is connected to the positive pole of the power supply. Therefore, the high lighting rate package structure is also a major key technology in the process of power LED lamp beads packaging. During the luminous process of the LED lamp chip chip, during the launch, due to the difference in refractive index at the interface, it will cause lithoscopic reflection and the possible full reflection damage. Relatively high transparent glue. This layer of transparent glue must have the characteristics of high light transmission, high refractive index, good liquidity, easy to spray, good thermal stability, etc. The transparent rubber layer that is often used today has two materials: epoxy resin and silicone. ----- The article comes from LED lamp beads,.