The technical characteristics of the LED lamp beads of the New Year's Eve (1) Connect the chip and aluminum alloyultra -heat guide material composite substrate (radiator) into one, and use a unique year -long power LELED lamp bead classification D light bead packaging technology. The chip is concentrated directly on the heat dissipation matrix to make the heat resistance between the chip and the heat dissipation substrate. Based on the thermal governance system of bionicism, the power -resistant model of the first -layer structural heat resistance model was established for the first heat dissipation of the LED lamp chip, which was set up. (2) Night -year -old power LED lamp chip is characterized by the two -layer structure of the cooling and integrated heat dissipation of the heat source chip. As the temperature of the heating source increases, the air flows in the porous radiator. The air convection provides a flow channel, and the heat is automatically emitted to ensure that the chip is normal in the safe use temperature range. Advanced thermal conductivity and heat -to -flow system ensure the excellent heat dissipation effect, which further improves the lighting efficiency of the chip. Putting the chip (45mil 45mi1) for integrated packaging (concentrated in a small area) to obtain a high -facial light source with high light effect, with the characteristics of high light flux density, high total light flux, low glare (3) Today, the above technology is used, and the above technology is used. The "Chip's Heading Integrated (Two -layer Structure) Mode) Mode" has been prepared. In addition, this year's power LED lamp bead car needs to strengthen the heat dissipation of electric fans the previous year, which is difficult to meet the needs of market -oriented application. The car light industry uses LED light source to manufacture the limitations of the car the previous year.
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