The Heat Dissipation Problem of High Brightness LED Lamp Beads

With the intensification of global energy shortage and artificial daytime issues, LED lighting with energy conservation and environmental protection and high reliability is increasingly valued. Generally speaking, the LED lamps created by LED light sources are composed of LED, heat dissipation structure, driver, and lens. At present, the heat dissipation of high brightness LED lamp beads on the market often uses natural heat dissipation with unsatisfactory effects. The effect is not ideal. To a certain extent, it also affects the life of the lamp. The heat treatment is the main problem in the application of high brightness LED lamp beads. Because the P -shaped doped of the III tribe nitrogen is limited by the dissolving degree of the MG and the high startup energy of the acupuncture point, the heat is particularly easy to produce in the P -shaped area. The heat dissipation pathway of LED lamp devices is mainly thermal conductivity and heat -flowing; the heat guide rate of the extremely low material of the SAPPHIRE substrate material will increase the heat resistance of the device, produce a serious self -heating effect. The effect of calories on high brightness LED is very large. The calories are concentrated in small size chips. The temperature of the chip rises, causing the non -uniform distribution of thermal stress, the lighting efficiency of the chip, and the fluorescent powder sprint efficiency; When a certain value, the device's disorders are increased by the index rules. Statistics show that the component temperature rises at 2 C, and the reliability decreases by 10%. When multiple LED -dense arrangements form a white light lighting system, the problem of dissipation of calories is more serious. Solving the problem of heat management has become a prerequisite for high brightness LED lamp bead applications. The relationship between the size and heat dissipation of the chip cannot be ignored. The most direct way to increase the brightness of the power LED is to increase the input power. In order to prevent the saturation of the source layer, the size of the P-N knot must be increased accordingly; the increase in input power must make the knot. Grow up temperature, then reduce quantum efficiency. The improvement of the single-pipe power depends on the ability of the device to guide the heat from the P-N to maintain the existing chip material, structure, packaging process, the current density of the current, and equivalent heat dissipation conditions. The temperature will continue to rise. The heat dissipation problem of LED lamp beads is closely related to many factors. In order to extend the service life of LED lamp beads and enhance reliability, comprehensive consideration is required. Under the premise of ensuring brightness and lighting effects.