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LED Lamp Bead Packaging Process Analysis

First, the high -quality light -level diode brand Tianhui Optoelectronics Technology Analysis of the existing existing packaging methods and the application field of LED lamp beads is the earliest, which is used to produce a single LED lamp bead packaging device. It is suitable for instrumental indicators, urban lighting projects, advertising screens, barriers, traffic indicators, and some products and fields that are currently commonly used in my country. Patch LED lamp bead packaging (SMD) is a kind of non -lead packaging, small and thin, which is very suitable for the keyboard display lighting of the mobile phone, the backlight of the TV, and the electronic products that require lighting or indications. In recent years It develops in the direction of large size and high power, a piece of three or four LED chips in a patch, which can be used for assembly lighting products. The module packaging is also a multi -chip with LED lamp bead packaging. On the aluminum or aluminum nitride substrate, dozens of or hundreds of LED lamp chips are encapsulated on the aluminum or aluminum nitride substrate. It is a mixed type, that is, there are multiple chips in series, and there are several parallel connection. This packaging is mainly to expand power, for lighting products. Due to the high density of the packaging, the heat generated during the application is large, and the heat dissipation is the primary problem to solve the application. The device produced by the above packaging method is used in the production of lighting fixtures. It has a common characteristic: the number of thermal resistance is large, it is difficult to produce high -quality lighting fixtures, and the connection processing requirements of the module itself and the radiator are relatively high. At present, all packaging methods are to mix yellow fluorescent powder (YAG) and epoxy resin evenly on different columns, and directly click on the blue -light LED lamp bead packaging chip. The advantage of this common practice is to save materials. The disadvantage is that it is not conducive to heat dissipation and fluorescent powder. Because epoxy resin and fluorescent powder are not good -conducting materials, and the entire chip wrapped in the entire chip will affect heat dissipation. This method is obviously not the best solution for making LED lighting fixtures. At present, the high -power chip produced abroad, the white -light chip above 0.5 watts is painted on a blue light chip on a even layer of evenly YAG fluorescent powder. There is no fluorescent powder in the cushion. This method can improve the light effect than the commonly used methods, so it is generally used abroad. ) As long as this white -ray chip is welded on the designed circuit board when packaging, it saves the process of applying fluorescent powder. It brings convenience to lamp manufacturers, but currently domestic suppliers of domestic production chips cannot produce such LED white light chips in large quantities. my country is the country that develops LED lantern street lights earlier. It is currently good in China because the country attaches importance to the "low -carbon economy". In 2009, my country implemented 10,000 LED street lights. The feasibility of street lights is based on street light applications, while foreign countries (Osram, Japan Asia, Samsung and other companies) take indoor lighting as a breakthrough. As far as our country is concerned, it is caused by the national conditions from LED street lighting. The reason is that my country's national income is low, and the cost of LED indoor lighting is higher. The use of LED street lights is the government's silver, and the high -power LED lamp bead street light production enterprise is justified. In fact, the working conditions of the LED street lights are more harsh than the indoor LED lamp bead lighting fixture, and the requirements are higher. If the quality is clear (heat dissipation, service life, color rendering, reliability, etc.), then then do the indoor LED lighting lights. It's easier. At present, LED giants abroad are launching a large number of hundreds of or even thousands of LED indoor lighting fixtures. But the packaging methods they use are mentioned earlier. The only Philips company, which makes fluorescent powder apply on the LED lampshade, and is rated as one of the most creative LED lighting products in 2009. The author believes that all LED lighting fixtures should be manufactured by multi -chip packaging and module packaging (module packaging is a high -density multi -chip package), and it is best to be packaged directly on the main body of the lamps. The number of roads is the least, and you can get better heat dissipation effects. Or make a line body with copper foil on the main body of the lamp, and its heat resistance is also low. The power of LED lighting is at least a few watts, so it is used by multiple chips. New methods and craftsmanship. Using multiple encapsulated LED lamp bead packaging devices to assemble LED lamps, it is difficult to create high -quality and highly reliable LED lamps. Technical personnel who want to engage in LED lamps can understand this. Second, the high -grade light -level diode brand Tianhui photoelectric technology analysis of the innovative module of the fluorescent powder coating process LED lamp beads packaged the fluorescent powder. At present, the fluorescent powder is directly applied to the chip. The fluorescence powder of the group is still the same, but different modules may appear in large quantities of production. The better way is to use LED fluorescent powder thin films or membranes. , Good consistency, LED lights are packaged by multi -chip, mixed with the light emitted, transformed by fluorescent powder or membranes to white light, the color difference can be eliminated. The requirements for the film and membranes are: 1 can pass through the light, between 0.1 ---- 0.5mm, the fluorescent powder is uniform, the appearance is flat. 2 The light conversion efficiency should be high, good stability, long life, good anti -aging. 3 It can be made into a sheet and a pieceless basis, and it can be made into a thin piece. The requirements for the foundation are colorless transparent anti -aging. 4 It is convenient for processing and forming, the size is arbitrarily cut, and the cost is low. Another method is to mix the fluorescent powder and transparent plastic proportion, directly produce a lampshade with fluorescent powder through injection molding machines and molds, and convert the blue light from the lampshade to white light. This is more troubled and convenient. Because the lampshade is converted to mixed blue light, the white light output has no color difference, and the light is softer. Third, in order to better solve the problem of LED lamp bead packaging heat dissipation, high -grade light emitting diode brand TIANHUI Optoelectronics Technology said: should be considered and encapsulated by the lamps, and the heat dissipation tablets for packaging the heat dissipation of LED lamp beads should be made into a whole, which effectively reduces the effect. The number of thermal blocks, this is a very effective and effective way to increase the heat dissipation of the lamp. At present, the LED lamp beads on the market do not have a heat sink. Such lamps cannot be high -power and high -quality and long life. The correct product design should consider the heat sink together. Industrialized production is the radiator of the LED lamp beads sunlight, squeezing out the aluminum profile of the semi -circular winged piece with a mold, and then cut the length of the required length according to the power size, and then Making aluminum -based copper foil lines, fix the chip on the copper foil, connect the gold wire or use the help machine to help. Such lamps have good heat dissipation effects, only two thermal resistances, one to two -way heat resistance than commonly used packaging methods, effectively reducing the temperature of the chip, which can effectively improve the quality and life of LED fluorescent lamps. Another method is to design sudden strips on aluminum profiles. Many rectangles are milling as needed. In the use of ordinary (0.8-1.0mm thick) PCB line boards according to the rectangular open -length square hole of aluminum profiles, paste the PCB line board or paste or paste or paste it or Riveting on aluminum profiles, the LED chip is fixed on the rectangular tap on the aluminum profile, and then connects the line on the PCB board with the gold wire. This production process is the best, the heat resistance is only one, and the heat dissipation effect is the best. Manufacturers who produce LED lamps should give priority to this solution. Secondly, the method of making copper foil lines on aluminum profiles. Only such an innovation can effectively solve the heat dissipation problem of LED lamp beads packaging long strip lamps, and can improve the quality and life of LED lamp beads packaging. Tags: & nbsp & nbspled lamp bead package

LED Lamp Bead Packaging Process Analysis 1

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