Uhlalutyo lweNkqubo yokuPhakhelwa kwesibane sesibane se-LED

Okokuqala, i-high-quality light-level diode brand Tianhui Optoelectronics Technology Uhlalutyo lweendlela ezikhoyo zokupakisha ezikhoyo kunye nentsimi yesicelo sokukhanya kwesibane se-LED yiyona yokuqala, esetyenziselwa ukuvelisa isixhobo esisodwa sokupakisha isibane se-LED. Ifanelekile izibonakaliso zezixhobo, iiprojekthi zokukhanyisa ezidolophini, izikrini zentengiso, izithintelo, izikhombisi zendlela, kunye nezinye iimveliso kunye nemimandla esetyenziswa ngoku ngokuqhelekileyo kwilizwe lam. Ukupakishwa kwesibane sesibane se-LED (i-SMD) luhlobo lwepakethi engelokhokelo, encinci kwaye ibhityile, ifaneleke kakhulu ukukhanyisa kwebhodibhodi yefowuni ephathwayo, ukukhanya ngasemva kweTV, kunye neemveliso zombane ezifuna ukukhanya okanye imiqondiso. . Kwiminyaka yakutshanje Iphuhlisa kwicala lobungakanani obukhulu kunye namandla aphezulu, iqhekeza lee-chips ezintathu okanye ezine ze-LED kwisiqwenga, esingasetyenziselwa ukudibanisa iimveliso zokukhanyisa. Ukupakishwa kwemodyuli kwakhona yi-multi-chip kunye nokupakishwa kwesibane sesibane se-LED. Kwi-aluminiyam okanye i-aluminiyam nitride substrate, ezininzi okanye amakhulu eetshiphusi zezibane ze-LED zifakwe kwi-aluminiyam okanye i-aluminiyam nitride substrate. Ludidi oluxubeneyo, oko kukuthi, kukho iitshiphusi ezininzi kuthotho, kwaye kukho unxibelelwano oluninzi oluhambelanayo. Oku kufakwa ikakhulu kukwandisa amandla, kwiimveliso zokukhanyisa. Ngenxa yobuninzi obuphezulu bokupakisha, ukushisa okwenziwa ngexesha lokusetyenziswa kukhulu, kwaye ukutshatyalaliswa kobushushu kuyingxaki ephambili yokusombulula isicelo. Isixhobo esiveliswe yindlela yokupakisha engentla isetyenziselwa ukuveliswa kwezixhobo zokukhanyisa. Inophawu oluqhelekileyo: inani lokuchasana kwe-thermal likhulu, kunzima ukuvelisa izixhobo zokukhanyisa ezikumgangatho ophezulu, kunye neemfuno zokudityaniswa kwemodyuli ngokwayo kunye ne-radiator ziphezulu. Okwangoku, zonke iindlela zokupakisha kukuxuba umgubo omthubi we-fluorescent (YAG) kunye ne-epoxy resin ngokulinganayo kwikholamu ezahlukeneyo, kwaye ucofe ngokuthe ngqo kwi-blue-light LED bead packaging chip. Inzuzo yolu qheliselo oluqhelekileyo kukugcina imathiriyeli. Ukungalungi kukuba akuncedi ukutshatyalaliswa kobushushu kunye ne-fluorescent powder. Ngenxa yokuba i-epoxy resin kunye ne-fluorescent powder ayizozinto zokuqhuba kakuhle, kwaye yonke i-chip esongelwe kwi-chip yonke iya kuchaphazela ukutshatyalaliswa kobushushu. Le ndlela ngokucacileyo ayisosisombululo ilungileyo sokwenza izibane ze-LED. Okwangoku, i-chip ephezulu yamandla eveliswa phesheya, i-white-light chip ngaphezulu kwe-0.5 watts ipeyintiwe kwi-blue light chip kuluhlu olulinganayo lwe-YAG fluorescent powder. Akukho mgubo we-fluorescent kwi-cushion. Le ndlela inokuphucula umphumo wokukhanya kuneendlela eziqhelekileyo ezisetyenziswayo, ngoko ke isetyenziswa ngokubanzi ngaphandle. ) Lo gama nje le chip ye-white-ray idityaniswe kwibhodi yesekethe eyiliweyo xa ipakishwa, igcina inkqubo yokufaka umgubo we-fluorescent. Izisa lula kubavelisi bezibane, kodwa okwangoku ababoneleli basekhaya beetshiphusi zemveliso yasekhaya abanako ukuvelisa iitshiphusi zokukhanya ezimhlophe ze-LED ngobuninzi. ilizwe lam lilizwe eliphuhlisa izibane zesitrato ze-LED ngaphambili. Kungokunje kulungile eTshayina kuba ilizwe lincamathela ukubaluleka kwi "low-carbon economy". Ngo-2009, ilizwe lam liphumeze izibane ze-LED eziyi-10,000. Ukwenzeka kwezibane zesitrato kusekelwe kwizicelo zokukhanya ezitalatweni, ngelixa amazwe angaphandle (i-Osram, i-Japan yase-Asia, i-Samsung kunye nezinye iinkampani) zithatha ukukhanya kwangaphakathi njengempumelelo. Ngokubhekiselele kwilizwe lethu, kubangelwa iimeko zelizwe ukusuka ekukhanyeni kwesitalato se-LED. Isizathu kukuba ingeniso yelizwe lam iphantsi, kwaye ixabiso lokukhanyisa ngaphakathi kwe-LED liphezulu. Ukusetyenziswa kwezibane zasesitalatweni ze-LED yisilivere karhulumente, kunye neshishini lokuvelisa ukukhanya kwesibane se-LED elinamandla aphezulu. Ngapha koko, iimeko zokusebenza zezibane zesitalato ze-LED ziqatha ngakumbi kunesixhobo sokukhanyisa isibane se-LED sangaphakathi, kwaye iimfuno ziphezulu. Ukuba umgangatho ucacile (ukutshatyalaliswa kobushushu, ubomi benkonzo, ukunikezelwa kombala, ukuthembeka, njl.), Emva koko wenze izibane ze-LED zangaphakathi. Kulula. Okwangoku, izigebenga ze-LED phesheya ziphehlelela inani elikhulu lamakhulu okanye amawaka ezixhobo zokukhanyisa ze-LED zangaphakathi. Kodwa iindlela zokupakisha abazisebenzisayo zikhankanywe ngaphambili. Inkampani ye-Philips kuphela, eyenza i-fluorescent powder ifake isicelo kwisibane sesibane se-LED, kwaye ihlelwe njengenye yezona mveliso zokukhanyisa i-LED ngo-2009. Umbhali ukholelwa ukuba zonke izibane ze-LED kufuneka zenziwe nge-multi-chip packaging kunye ne-module packaging (imodyuli yokupakisha i-high-density multi-chip package), kwaye kulungele ukupakishwa ngokuthe ngqo kumzimba oyintloko wezibane. Inani leendlela lincinci, kwaye unokufumana iziphumo ezingcono zokulahla ubushushu. Okanye wenze umgca womgca nge-foil yobhedu kumzimba oyintloko wesibane, kwaye ukumelana nokushisa kwayo kuphantsi. Amandla okukhanya kwe-LED ubuncinci batts ezimbalwa, ngoko ke isetyenziswa ziichips ezininzi. Iindlela ezintsha kunye nobugcisa. Ukusebenzisa izixhobo zokupakisha zesibane ze-LED ezininzi ezigqunyiweyo ukudibanisa izibane ze-LED, kunzima ukwenza izibane ze-LED ezikumgangatho ophezulu kunye nezithembeke kakhulu. Abasebenzi bezobugcisa abafuna ukubandakanya izibane ze-LED banokuqonda oku. Okwesibini, i-high-grade light -level diode brand Tianhui photoelectric technology analysis of the module innovative of fluorescent powder coating process Amaso esibane apakishwe ngumgubo wefluorescent. Okwangoku, i-fluorescent powder isetyenziswe ngokuthe ngqo kwi-chip. Ipowder ye-fluorescence yeqela isafana, kodwa iimodyuli ezahlukeneyo zingabonakala ngobuninzi bemveliso. Eyona ndlela ingcono kukusebenzisa i-LED fluorescent powder films okanye iimbrane ezibhityileyo. , Ukuhambelana kakuhle, izibane ze-LED zifakwe kwi-multi-chip, zixutywe nokukhanya okukhutshweyo, ukuguqulwa ngumgubo we-fluorescent okanye i-membrane ekukhanyeni okumhlophe, umehluko wombala unokupheliswa. Iimfuno zefilimu kunye neembrane zezi: i-1 inokudlula ekukhanyeni, phakathi kwe-0.1 ---- 0.5mm, umgubo we-fluorescent ufana, ukubonakala kucaba. 2 Ukusebenza kokuguqulwa kokukhanya kufuneka kube phezulu, uzinzo oluhle, ubomi obude, ukulwa nokuguga okuhle. 3 Ingenziwa ibe ishidi kunye nesiseko esingenamaqhekeza, kwaye sinokwenziwa ibe yincinci encinci. Iimfuno zesiseko azinambala transparent anti -aging. I-4 Ilungele ukusetyenzwa kunye nokwenza, ubungakanani bunqunywe ngokungqongqo, kwaye ixabiso liphantsi. Enye indlela kukudibanisa umgubo we-fluorescent kunye nomlinganiselo weplastiki ecacileyo, ukuvelisa ngokuthe ngqo umthunzi wesibane kunye nomgubo we-fluorescent ngoomatshini bokubumba kunye nokubumba, kunye nokuguqula ukukhanya okuluhlaza ukusuka kwisibane ukuya kukukhanya okumhlophe. Oku kunenkathazo kwaye kulula. Kuba isibane sesibane siguqulwa sibe sisibane esiluhlaza esixutyiweyo, ukukhanya okumhlophe akunamahluko wombala, kwaye ukukhanya kuthambile. Okwesithathu, ukuze ukusombulula ngcono ingxaki isibane LED bead ukupakisha ukuchithwa ubushushu, high-grade ukukhanya ukukhanya diode brand TIANHUI Optoelectronics Technology wathi: kufuneka ziqwalaselwe kwaye zigqunywe yi izibane, kunye tablets yokuchitha ubushushu ukupakisha ukuchithwa ubushushu LED. izibane zesibane kufuneka zenziwe ziphelele, ezinciphisa ngempumelelo umphumo. Inani leebhloko ze-thermal, le yindlela efanelekileyo kakhulu kwaye isebenzayo yokunyusa ukutshatyalaliswa kokushisa kwesibane. Okwangoku, izibane zesibane se-LED kwimarike azinayo indawo yokushisa. Izibane ezinjalo azikwazi ukuba namandla aphezulu kunye nomgangatho ophezulu kunye nobomi obude. Uyilo oluchanekileyo lwemveliso kufuneka luthathele ingqalelo i-heat sink kunye. Imveliso yemizi-mveliso yiradiyetha yesibane se-LED amaso ukukhanya kwelanga, ukucudisa ngaphandle iprofayile aluminiyam yesiqwenga semi-setyhula enamaphiko ngongundo, uze unqumle ubude obufunekayo ngokobukhulu bamandla, kwaye ke Ukwenza i-aluminium-based copper. imigca ye-foil, lungisa i-chip kwi-foil yobhedu, udibanise ucingo lwegolide okanye usebenzise umatshini wokunceda ukunceda. Izibane ezinjalo zinemiphumo emihle yokutshatyalaliswa kobushushu, ukuxhathisa okubili kokushisa, enye ukuya kwiindlela ezimbini zokumelana nobushushu kuneendlela zokupakisha eziqhelekileyo ezisetyenziswayo, ukunciphisa ngokufanelekileyo ubushushu be-chip, obunokuphucula ngokufanelekileyo umgangatho kunye nobomi bezibane ze-LED fluorescent. Enye indlela kukuyila imicu ngequbuliso kwiiprofayili ze-aluminium. Ooxande abaninzi bayasila njengoko kufuneka. Ekusetyenzisweni kweebhodi eziqhelekileyo (0.8-1.0mm ubukhulu) iibhodi zomgca we-PCB ngokwe-rectangular open-length square hole yeeprofayili ze-aluminium, ncamathelisa ibhodi yomgca we-PCB okanye uncamathisele okanye unamathisele okanye u-Riveting kwiiprofayili ze-aluminium, i-chip ye-LED igxininiswe kwimpompo yoxande kwiprofayili yealuminiyam, kwaye emva koko idibanisa umgca kwibhodi yePCB ngocingo lwegolide. Le nkqubo yokuvelisa iyona nto ibhetele, ukuchasana nobushushu kukunye kuphela, kwaye umphumo wokutshatyalaliswa kobushushu ungcono kakhulu. Abavelisi abavelisa izibane ze-LED kufuneka banike kuqala kwesi sisombululo. Okwesibini, indlela yokwenza imigca yefoyile yobhedu kwiiprofayili ze-aluminium. Kuphela inguqulelo enjalo inokusombulula ngokufanelekileyo ingxaki yokutshatyalaliswa kobushushu kwezibane ze-LED ezipakisha izibane ze-strip ezide, kwaye zinokuphucula umgangatho kunye nobomi bokupakishwa kwesibane se-LED. Iziphawuli: & Nbsp & Nbspled coad coad