Umehluko Phakathi Kobuhlalu Belambu Oludidiyelwe

Uma kukhulunywa ngomthombo wokukhanya kwesibani se-LED, ukukhanya kwe-LED kulawulwa yi-micro chip eyakhelwe ngaphakathi. Ekusetshenzisweni kobunjiniyela obuncane, ingasetshenziswa ngaphandle kwesilawuli, esingafinyelela i-gradient, ukweqa, ukukhanya kombala, ukukhanya okungahleliwe, amafomu okupakisha ama-chip ngendlela yokupakisha ku-chip. Kunezinhlobo eziningi, i-COB ingenye yazo. Nakuba ukuhumusha kwe-COB (Chip On Board) kubonakala kuyi-chip efakwe ebhodini. Kodwa kusukela emlandweni we-COB, “I-Chip ebhodini ”phakathi “Ibhodi ”Kwakungasho okuvamile ekuqaleni “ipuleti ”Kunalokho, ibhekisela ebhodini lesifunda eliphrintiwe (PCB). Ekupakishweni kwamadivayisi we-semiconductor, amaningi awo agxiliwe ku-substrate futhi ahlanganiswe, kodwa awabizwa ngokuthi ukupakisha kwe-COB. Ngakho-ke, i-COB encapsulated substrate (IBHODI) ayibhekiseli ebhodini elivamile. Isizathu esiyinhloko sokwehluleka okukhulu ukwehluleka ukuphuzi noma ukuncishiswa kwe-silicone noma ukunciphisa. Ama-electrode e-LED P no-N asemthethweni asohlangothini olufanayo lwe-LED. Okwamanje kufanele agezele kungqimba lwe-N-GAN ngokuvundlile, okuholela kumanje ominyene, ukushisa kwendawo okuphezulu, futhi kukhawulele amandla okushayela. Inyamalala. Enkambweni yokusetshenziswa kwesikhathi eside, izinga lokushisa eliphezulu elibangelwa ukuchithwa kokushisa okungalungile lithinta ukusebenza nokudluliselwa kwe-silicone, okubangela ukuncishiswa kwamandla okukhanya okukhulu. Imiphumela eguquguqukayo yobuhlalu besibani obudidiyelwe ngokushintshana ingafinyelela umphumela wokujaha, ukuskena ngokulawulwa kwe-DMX. Njengamanje, lezi zindawo zokufaka izicelo eziyinhloko cishe yilezi: izakhiwo ezilodwa, iqembu lesakhiwo somlando ukukhanyisa odongeni lwangaphandle, ukukhanya nokukhanya kwangaphandle esakhiweni, ukukhanyisa kwendawo yangaphakathi, ukukhanya kwe-landscape eluhlaza, ukukhanyisa ikhadi lokukhangisa, nangaphezulu kunemithombo yokukhanya ye-LED. Eqinisweni, ukuqagela kuyaqagela. Umshini futhi unemithombo yokukhanya yesibani (amalambu e-ultra -high -pressure mercury namalambu e-pyrine) kanye nemithombo yokukhanya ye-laser. Imithombo yokukhanya yamalambu iyimithombo yokukhanya yendabuko. Imithombo yokukhanya ye-LED nemithombo yokukhanya ye-laser imithombo yokukhanya emisha. Ngenxa yamandla amakhulu emakethe ebuhlalu besibani obuhlanganisiwe, ukusetshenziswa kwezimboni ezihlobene ne-LED kukhula ngokushesha kusuka ekukhanyeni okuvamile kuya cishe kuzo zonke izinkambu. Ngokuhlukile ekukhanyisweni okuvamile, izicelo zokukhanyisa kwezinye izinkambu ezikhethekile nazo zithole ukunakwa okwengeziwe, futhi amathemba emakethe aya ngokuya eba nethemba. Lezi zinhlelo zokusebenza zidinga ukuthembela kumthombo wokukhanya we-LED okhethekile. Ngokombono wenqubo yokupakisha, maningi amasayizi asetshenziswa umthombo wokukhanya we-COB. Izimo zayo ziyinqwaba yama-stents anosayizi abahlukene njengesikwele, unxande, i-ellipse. Smedie, ngokuvamile musa ukuletha izinyawo. Abakaki abasetshenziswa ebuhlalu belambu be-LED edidiyelwe yi-10W, 100W, 500W kuphela kanye nabanye abakaki besikwele. Izinto ezisetshenziswayo ngokuyinhloko ziyithusi, futhi amabakaki anezinyawo ezihlangothini ezingu-2. Lapho ukhetha ukukhanya kwangaphandle kumaphrojekthi wobunjiniyela bokwakha noma engadini, kuzokhethwa isibhamu se-LED. Isibani esinjalo sokukhanya sinenzuzo ethile ngokwaso. Mayelana nale mithombo yokukhanya ye-LED eshayelwa mahhala, ukukhanya kwe-LED pan -light kuwumthombo wamachashazi ongakhanyiswa ngokulinganayo kuzo zonke izinhlangothi. Ibanga layo lokushiswa kwemisebe lingalungiswa ngokuzenzakalelayo. Ukuze uthole ukunwetshwa okuhle kwamanje, ungqimba lwe-electrode yensimbi ye-NI-AU alukwazi ukuba luncane kakhulu. Ngenxa yalesi sizathu, ukusebenza kahle kokukhanyisa kwedivayisi kuzothinteka kakhulu. Ngokuvamile, zombili izici: kokubili ukunwetshwa kwamanje nokusebenza kahle kokuphuma. Kodwa ngaphansi kwaziphi izimo, ukuba khona kwefilimu yensimbi kuzohlala kwenza ukusebenza kokudlulisa ukukhanya kube kubi kakhulu. Ngaphezu kwalokho, ukuba khona kwejoyinti le-welding ehamba phambili nakho kuthinta ukusebenza kahle kokukhanya kwedivayisi. Isakhiwo se-chip ye-Ganled ehlanekezelwe ingaqeda izinkinga ezingenhla ngenhla. Esikhathini esizayo, imakethe izothuthuka ekuqondeni kobuchwepheshe. Ngokombono we-optical, i-CSP ifaneleka kakhulu ogibeni futhi ayifaneleki izibani zokudubula. EMC & I-PCT ifaneleka kakhulu emikhiqizweni yamandla emincane namaphakathi enezindleko eziphezulu zokusebenza. Ukupakishwa kweCeramic kulungele imikhiqizo emincane yamandla amakhulu. Noma ngabe ubuchwepheshe be-CSP buvuthwe kakhulu, ngemuva kwakho konke, akunakwenzeka ukunciphisa usayizi ngosayizi, futhi kusazoba namabhodlela. Imakethe yokusinda yomkhiqizi wokupakisha isabonakala kakhulu. Ubuhlalu obuhlanganisiwe bokukhanya i-pan -light iwumthombo wokukhanya osetshenziswa kakhulu ekuhumusheni. Izibani ezijwayelekile ze-pan-light zisetshenziselwa ukukhanyisa indawo yonke. Ungasebenzisa izibani eziningi ze-pan -light endaweni yesehlakalo ukuze ukhiqize imiphumela engcono.