Umahluko phakathi kwaMaso ezibane eziDityanisiweyo

Xa kuziwa kumthombo wokukhanya kwesibane se-LED, ukukhanya kwe-LED ukukhanya kulawulwa yi-chip encinci eyakhelweyo. Ekusetyenzisweni kobunjineli obuncinci, inokusetyenziswa ngaphandle komlawuli, onokufikelela kwi-gradient, ukuxhuma, ukukhanya kombala, ukukhanya okungahleliwe, iifom zokupakisha i-chip ngendlela yokupakisha kwi-chip. Zininzi iindidi, iCOB yenye yazo. Nangona i-COB (i-Chip On Board) ukuguqulelwa kwangempela kubonakala ngathi yi-chip efakwe ebhodini. Kodwa kwimbali yeCOB, “Chip kwiBhodi ”phakathi “Ibhodi ”Yayingathethi into eqhelekileyo ekuqaleni “ipleyiti ”Endaweni yoko, ibhekisa kwibhodi yesekethe eprintiweyo (PCB). Kwi-package yezixhobo ze-semiconductor, ezininzi zazo zigxininiswe kwi-substrate kwaye zipakishwe, kodwa azibizwa ngokuba yi-COB yokupakisha. Ngoko ke, i-COB encapsulated substrate (IBHODI) ayibhekiseli kwibhodi eqhelekileyo. Esona sizathu siphambili sokungaphumeleli okukhulu kukutyheli okanye ukuncitshiswa kwe-silicone okanye ukunciphisa. I-LED P kunye ne-N electrode esemthethweni ikwicala elifanayo le-LED. Umjelo kufuneka uhambe ngaphaya kwe-N-GAN umaleko ngokuthe tye, okukhokelela kumbane ogcweleyo, ubushushu obuphezulu bendawo, kunye nokunciphisa umsinga wokuqhuba. Inyamalala. Kwinkqubo yokusetyenziswa kwexesha elide, ubushushu obuphezulu obubangelwa ukutshatyalaliswa kobushushu buchaphazela ukusebenza kunye nokuhanjiswa kwe-silicone, okubangela ukukhutshwa kwamandla okukhanya okukhulu. Iimpembelelo eziguquguqukayo zamaso ezibane ezidibeneyo ngokutshintshana zinokuthi zifezekise umphumo wokusukela, ukuskena ngolawulo lwe-DMX. Okwangoku, ezi ndawo zezicelo eziphambili mhlawumbi zezi: izakhiwo ezingatshatanga, iqela lokwakhiwa kwembali yangaphandle yodonga, ukukhanya kunye nokubonakala kwangaphandle kwisakhiwo, ukukhanya kwendawo yangaphakathi, ukukhanya kwendawo eluhlaza, ukukhanyiswa kwekhadi lentengiso, kwaye ngasentla yimithombo yokukhanya ye-LED. Enyanisweni, uqikelelo luqikelelwe ngokwenene. Umatshini nawo unemithombo yokukhanya yebhalbhu yokukhanya (izibane zemercury ze-ultra -high-pressure kunye nezibane zepyrine) kunye nemithombo yokukhanya yelaser. Imithombo yokukhanya yebhalbhu yimithombo yokukhanya yemveli. Imithombo yokukhanya ye-LED kunye nemithombo yokukhanya ye-laser yimithombo yokukhanya emitsha. Ngenxa yesakhono esikhulu semarike kumaso esibane adibeneyo, ukusetyenziswa kwamashishini anxulumene ne-LED kukhula ngokukhawuleza ukusuka ekukhanyeni ngokubanzi ukuya phantse kuzo zonke iindawo. Ngokwahlukileyo kukukhanya okuqhelekileyo, izicelo zokukhanyisa kwezinye iindawo ezikhethekileyo nazo zifumene ingqalelo engakumbi nangakumbi, kwaye ithemba lemarike liya lisiba nethemba ngakumbi. Ezi zicelo kufuneka zithembele kumthombo okhethekileyo wokukhanya kwe-LED. Ngokombono wenkqubo yokupakisha, kukho ubungakanani obuninzi obusetyenziswa ngumthombo wokukhanya we-COB. Iimilo zayo zininzi zeestents ezinobungakanani obahlukeneyo njengesikwere, uxande, iellipse. Smedie, ngokuqhelekileyo musa ukuzisa iinyawo. Izibiyeli ezisetyenziswe kwiibhothi zesibane ze-LED ezidibeneyo ziyi-10W, i-100W, i-500W kuphela kunye nezinye izibiyeli zesikwere. Izinto eziphathekayo zinobhedu, kwaye iibakaki zineenyawo ezi-2 zecala. Xa ukhetha ukukhanya kwangaphandle kubunjineli bokwakha okanye iiprojekthi zegadi, i-LED shots iya kukhethwa. Isibane esinjalo sokukhanya sinenzuzo ethile ngokwaso. Ngokumalunga nale mithombo yokukhanya ye-LED eqhutywa simahla, i-LED pan -light light ngumthombo wamachaphaza anokukhanya ngokulinganayo kuwo onke amacala. Uluhlu lwalo lwe-irradiation lunokulungiswa ngokungaqhelekanga. Ukuze ufumane ukwandiswa okuhle kwangoku, i-NI-AU yensimbi ye-electrode layer ayikwazi ukuba yincinci kakhulu. Ngenxa yesi sizathu, ukukhanyisa ukukhanya kwesixhobo kuya kuchaphazeleka kakhulu. Ngokuqhelekileyo, zombini izinto: zombini ukwanda kwangoku kunye nokusebenza kakuhle kokuphuma. Kodwa phantsi kweziphi iimeko, ubukho befilimu yensimbi buya kuhlala busenza ukuba ukusebenza kokuhanjiswa kokukhanya kubi nakakhulu. Ukongeza, ubukho bomdibaniso ohamba phambili we-welding buchaphazela ukukhanya kokukhanya kwesixhobo. Ubume be-Ganled inverted chip inokuphelisa ngokusisiseko ezi ngxaki zingasentla. Kwixesha elizayo, imarike iya kuphuhlisa kwicala lobugcisa. Ukusuka kwimbono ye-optical, i-CSP ifanelekile ngakumbi kumgibe kwaye ayifanelekanga kwizibane zokudubula. EMC & I-PCT ifaneleke ngakumbi kwiimveliso zamandla ezincinci naphakathi ezinobungakanani obuphezulu bokusebenza. Ukupakishwa kweCeramic ifanelekile kwiimveliso ezincinci ezinobungakanani obuphezulu. Nangona iteknoloji ye-CSP ikhulile, emva kwayo yonke into, akunakwenzeka ukunciphisa ubungakanani ngobukhulu, kwaye kuya kubakho iibhotile. Imarike yokusinda yomenzi wokupakisha isenkulu kakhulu. Amaso okukhanya adibeneyo epani -ukukhanya ngowona mthombo wokukhanya usetyenziswa ngokubanzi kwiinguqulelo. Izibane eziqhelekileyo ze-pan-light zisetyenziselwa ukukhanyisa yonke indawo. Ungasebenzisa izibane ezininzi ze-pan-light kwindawo yomboniso ukuvelisa iziphumo ezingcono.