Kutheni iModyuli yoMthombo wokukhanya we-ACLED ingekho lula ukuba yamkelwe

Kwiminyaka yakutshanje, isihloko semodyuli yomthombo wokukhanya we-ACLED ishushu kakhulu kwishishini, kodwa izicelo zayo zincinci. Enyanisweni, yayisele ibonakala phesheya. Kwangoko ngo-2005, inkampani ye-semiconductor yaseMzantsi Korea yayisebenzise iimodyuli zomthombo wokukhanya we-ACLED ukuze zikhanyise ngeemodyuli zomthombo wokukhanya we-ACLED. Okwesibini, iUnited States, iJamani, iTaiwan, njl. ukuveliswa kwemizi-mveliso egqityiweyo, kwaye kwabakho. Imveliso yemodyuli yomthombo wokukhanya we-ACLED yesisombululo senkqubo yesicelo. Ngophuhliso lwemodyuli yomthombo wokukhanya we-ACLED phesheya, kukho iinkampani ezininzi kwilizwe lethu eziphanda kwaye ziyisebenzise, ​​kodwa umphumo awubonakali kangako. Ngenxa yokuba i-disadvantage engundoqo ye-ACLED yomthombo wokukhanya kwemodyuli ye-architecture eyodwa-core kukudibanisa izixhobo ezininzi ezikhanyayo kwingqolowa encinci, kwaye indawo ye-chip encinci inqunyelwe kakhulu kwimveliso yamandla aphezulu. Akulula ukulawula. Xa i-voltage yegridi yamandla iphakama okanye amandla okusabalalisa akhula ngokukhawuleza, kuya kulimaza kakhulu ngaphakathi kwayo. "Injini yokukhanya" edumileyo okwangoku ifakwe ngokubanzi kunye ne-aluminium substrate C0B, itekhnoloji yetekhnoloji yangoku. Iphakamisa isisombululo esisebenzayo semveliso yamandla aphezulu, ibe yeyona nto iphambili kwimodyuli yomthombo wokukhanya we-ACLED. Nangona kunjalo, ukungonakali okubulalayo kobu buchwepheshe kukuba kufuneka kuxhomekeke kwiipleyiti ezisekelwe kwi-aluminium ezinokumelana nobushushu obuhlukeneyo. I-aluminium yendabuko (okanye yobhedu) i-substrate kukwenza ibhodi ye-fiber ye-FR4 okanye ibhodi ye-BT ngokusebenzisa inkqubo yokucinezela ukuba ibe yi-aluminium substrates edibeneyo. I-W / M-K imalunga namaxesha angama-100 umahluko kwi-coefficient conduction yobushushu ye-aluminium ecocekileyo engenamaleko wokugquma. Iya kwandisa umlinganiselo wokusetyenziswa kobushushu kwipakethe enkulu yokumelana nobushushu, kwaye iya kukhawulezisa ukukhanya kwe-LED ngaxeshanye. I-Deatromy kunye nomonakalo unciphise ubomi be-LED. Nangona abanye abantu basebenzisa i-ceramic substrates, nangona i-coefficient conductivity ye-thermal iphuculwe, kusekho iingxaki ezininzi ngokuchithwa kobushushu obusisigxina bomzimba wesibane. Imodyuli yomthombo wokukhanya we-ACLED iphuhliswe ngokuthe ngcembe, kodwa ayilunganga ngokwaneleyo ukukhanyisa ukukhanya kunye nokuphuma kwamandla aphakathi. Okubaluleke ngakumbi, ukusetyenziswa kokutshatyalaliswa kokushisa okungahambi kakuhle okuziswa yi-SMD kunye neeplati ezisekelwe kwi-aluminium zichaphazela ukuzinza kunye nobomi. Izisombululo ezitsha, ngexesha elifanayo imodyuli yomthombo wokukhanya we-ACLED ihlala iphucula. Xa ivuthwa, iya kuthimba imarike ngendlela elula, akukho ziguquli, i-electrolytic capacitors kunye nezinto ezingaphezulu kwe-peripheral, itekhnoloji ehlanganisiweyo yokupakishwa. Imodyuli yomthombo wokukhanya we-ACLED idlulile kwinqanaba le-bud kwaye ikwixesha lophuhliso olukhawulezayo. Ngokombono wophuhliso lwayo, iteknoloji yemodyuli yokukhanya ye-ACLED ngokuqinisekileyo iya kuba yinkokeli kuphuhliso loshishino. Abanye abantu bacinga ukuba kwiimarike ezikufutshane ezizayo, ngaphezu kwe-80% yayo yonke imarike yesicelo iya kwamkela imodyuli yomthombo wokukhanya we-ACLED, kwaye iya kutshintsha imodeli yoshishino lwe-LED.