Njani malunga noMgaqo weGuangdong oguqulweyo weCOB umthombo wokukhanya

Kwiminyaka emibini ezayo, i-COB iya kuba yeyona nto iphambili yokukhanya kwezorhwebo. Ngesiseko sokwenza umsebenzi omhle weemveliso zokukhanyisa zorhwebo, iinkampani zokukhanyisa kufuneka zihlangabezane neemfuno zabathengi kwi-optics kunye nesakhiwo. Ke ngoko, iindleko-ukusebenza kokukhanya kwe-COB yorhwebo kufuneka kwenziwe. Iingxaki eziphezulu; 2. Gcina iindleko, akukho mfuneko yokwenza iibhodi PCB; 3. Izicelo zanamhlanje zingafakwa kwaye zisetyenziswe ngokuthe ngqo, ukugcina izixhobo kunye neendleko zokusebenza. Umgaqo womthombo wokukhanya we-COB ngoku yiphakheji ye-COB ye-LED, esekelwe kwisiseko sokupakisha se-substrate yethala leencwadi, eliza kufumana iitshiphusi ze-N kwipleyiti ye-Liquie kwaye uzipakishe kunye. Ngaphantsi kwe-substrate yi-foil yobhedu. I-foil yobhedu ingaba yinto enhle kakhulu. Amandla alungileyo-anamandla aguqulweyo aguqulweyo kwimigaqo yomthombo wokukhanya weCOB umthombo wokukhanya ozinzileyo wombane, uyilo lwesekethe, uyilo lokukhanya, kunye noyilo lokuphelisa ubushushu zisayensi kwaye zisengqiqweni; Umthombo wokukhanya we-COB usebenzisa itekhnoloji yenkqubo yokutshona kwe-thermal ukuqinisekisa ukuba i-LED inezinga elihamba phambili lokugcinwa kobushushu kushishino (95%). Kulula ukuququzelela izibonelelo zokukhanya zesibini zemveliso ukuphucula umgangatho wokukhanyisa. ; Umthombo wokukhanya we-COB unokunikezelwa kombala ophezulu, ukukhanya okufanayo, amabala okukhanya, impilo kunye nokukhuselwa kwendalo. , Ayikwazi ukwenza i-optical processing elungileyo .mcob kunye nemveli. Itekhnoloji ye-MCOB ibekwe ngokuthe ngqo kwiikomityi ze-optical zechip. Yenziwe ngokwe-optics. Ayiyondebe kuphela. Ukuba ugxininise ngaphakathi kwi-chip, kufuneka ubaleke ngakumbi, kwaye ufuna iimpondo ezininzi. Oko kukuthi, xa umlomo ulula, ngcono ukusebenza kakuhle kunokuphuculwa. Amaqela e-Swing, itekhnoloji eyahlukeneyo eguqulelwe kwimigaqo yomthombo wokukhanya we-COB ehambelana nezicelo ezahlukeneyo, zonke zineempawu zazo ezizodwa. Umthombo wokukhanya we-SMD wokupakisha uncamathisele izixhobo ezininzi ezahlukeneyo kwibhodi yePCB ngendlela yepetshi ukwenza icandelo lomthombo wokukhanya kwizicelo ze-LED. Ngenxa yokuba ukupakishwa kwe-COB yipakethe edibeneyo, ngumthombo wokukhanya, omkhulu kwaye kulula ukuwulungisa, ukunciphisa ukulahleka kokukhanya kokukhanya. Unokuphucula ngokufanelekileyo umbala womthombo wokukhanya ngokongeza indibaniselwano efanelekileyo yetshiphu ebomvu ukuze uphucule ngokufanelekileyo umbala womthombo wokukhanya. I-Intersection Ngokubhekiselele ekusebenzeni kokukhanya kunye neendleko zomthombo wokukhanya we-COB oguqulweyo: I-COB kukufaka i-chip ye-LED kwi-substrate yelayibrari yonke. Ngenxa yokugquma kweglue yokupakisha kunye ne-fluorescent powder, kwenza kube nzima ukuvuselela i-fluorescent powder kwi-edge part. Ukusetyenziswa kwe-fluorescence powder kubangele inkunkuma eninzi yomgaqo-siseko wemithombo yokukhanya ye-COB: iingenelo zokuvelisa ngokufanelekileyo zifana nenkqubo yemveli yokuvelisa i-SMD, eyona nto ifana nenkqubo yemveli yokuvelisa i-SMD. Ngokusisiseko iyalingana, kodwa ukusebenza kakuhle kokupakishwa kwe-COB kuphezulu kakhulu kuneemveliso ze-SMD kwiglu yamachaphaza, ukwahlula, ukuspana, ukupakisha. Ibalelwa malunga ne-10% yeendleko zemathiriyeli. Ukuba usebenzisa ukupakishwa kweCOB, iindleko zabasebenzi nezokuvelisa zingagcina i-5%. . Itekhnoloji ye-MCOB ifaka iitshiphusi ze-LED kwikomityi yamehlo, ifunda inqaku leglu yesixhobo se-LEDSMD, ipeyinti ye-fluorescence yomgubo kwitshiphu nganye kwaye igqibezele ichaphaza. Kwangaxeshanye, ukukhanya okukhupha itshiphu ye-LED kugxininiswe ngaphakathi kwitshiphu. Imithombo yokukhanya yenqwelomoya yeMcOB ziikomityi ezininzi zeechips ezidibeneyo, ezibonelela ngeevenkile ezininzi, ukuze ukukhanya kuthunyelwe ngokupheleleyo, kwaye ukusebenza kokukhanya kuphuculwe kakhulu. Okulandelayo: Indima yomthombo wokukhanya we-Guangdong COB kunye ne-LED